Ryzen AI 9 HX 370 vs Ryzen 9 7900X3D
Aggregate performance score
Ryzen 9 7900X3D outperforms Ryzen AI 9 HX 370 by a considerable 42% based on our aggregate benchmark results.
Primary details
Comparing Ryzen 9 7900X3D and Ryzen AI 9 HX 370 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 129 | 231 |
| Place by popularity | not in top-100 | not in top-100 |
| Cost-effectiveness evaluation | 46.66 | no data |
| Market segment | Desktop processor | Laptop |
| Series | AMD Ryzen 9 | no data |
| Power efficiency | 25.02 | 75.64 |
| Architecture codename | Raphael (2023−2024) | Strix Point (2024) |
| Release date | 4 January 2023 (1 year ago) | July 2024 (recently) |
| Launch price (MSRP) | $599 | no data |
Cost-effectiveness evaluation
Performance per price, higher is better.
Detailed specifications
Ryzen 9 7900X3D and Ryzen AI 9 HX 370 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 12 (Dodeca-Core) | 12 (Dodeca-Core) |
| Threads | 24 | 24 |
| Base clock speed | 4.4 GHz | 2 GHz |
| Boost clock speed | 5.6 GHz | 5.1 GHz |
| Bus rate | no data | 54 MHz |
| L1 cache | 64K (per core) | 80 KB (per core) |
| L2 cache | 1 MB (per core) | 1 MB (per core) |
| L3 cache | 128 MB (shared) | 24 MB (shared) |
| Chip lithography | 5 nm, 6 nm | 4 nm |
| Die size | 2x 71 mm2 | no data |
| Maximum core temperature | no data | 100 °C |
| Maximum case temperature (TCase) | 47 °C | no data |
| Number of transistors | 13,140 million | no data |
| 64 bit support | + | + |
| Windows 11 compatibility | + | no data |
| Unlocked multiplier | + | - |
Compatibility
Information on Ryzen 9 7900X3D and Ryzen AI 9 HX 370 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | 1 |
| Socket | AM5 | FP8 |
| Power consumption (TDP) | 120 Watt | 28 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Ryzen 9 7900X3D and Ryzen AI 9 HX 370. You'll probably need this information if you require some particular technology.
| Instruction set extensions | no data | USB 4, XDNA 2 NPU (50 TOPS), SMT, AES, AVX, AVX2, AVX512, FMA3, MMX (+), SHA, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A |
| AES-NI | + | + |
| AVX | + | + |
| Precision Boost 2 | + | + |
Virtualization technologies
Virtual machine speed-up technologies supported by Ryzen 9 7900X3D and Ryzen AI 9 HX 370 are enumerated here.
| AMD-V | + | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Ryzen 9 7900X3D and Ryzen AI 9 HX 370. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR5-5200 | DDR5 |
| Maximum memory size | 128 GB | no data |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card Compare | AMD Radeon Graphics | AMD Radeon 890M |
Peripherals
Specifications and connection of peripherals supported by Ryzen 9 7900X3D and Ryzen AI 9 HX 370.
| PCIe version | 5.0 | 4.0 |
| PCI Express lanes | 24 | 16 |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Combined synthetic benchmark score
This is our combined benchmark performance rating. We are regularly improving our combining algorithms, but if you find some perceived inconsistencies, feel free to speak up in comments section, we usually fix problems quickly.
Passmark
Passmark CPU Mark is a widespread benchmark, consisting of 8 different types of workload, including integer and floating point math, extended instructions, compression, encryption and physics calculation. There is also one separate single-threaded scenario measuring single-core performance.
Pros & cons summary
| Performance score | 31.73 | 22.38 |
| Integrated graphics card | 1.98 | 21.52 |
| Chip lithography | 5 nm | 4 nm |
| Power consumption (TDP) | 120 Watt | 28 Watt |
Ryzen 9 7900X3D has a 41.8% higher aggregate performance score.
Ryzen AI 9 HX 370, on the other hand, has 986.9% faster integrated GPU, a 25% more advanced lithography process, and 328.6% lower power consumption.
The Ryzen 9 7900X3D is our recommended choice as it beats the Ryzen AI 9 HX 370 in performance tests.
Note that Ryzen 9 7900X3D is a desktop processor while Ryzen AI 9 HX 370 is a notebook one.
Should you still have questions on choice between Ryzen 9 7900X3D and Ryzen AI 9 HX 370, ask them in Comments section, and we shall answer.
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