VIA C3-M C3-M-1500 vs Celeron M 360
Primary details
Comparing Celeron M 360 and VIA C3-M C3-M-1500 processor market type (desktop or notebook), architecture, sales start time and price.
Place in the ranking | not rated | not rated |
Place by popularity | not in top-100 | not in top-100 |
Market segment | Laptop | Laptop |
Series | Celeron M | C3-M |
Architecture codename | Dothan (2004−2005) | Nehemiah |
Release date | no data (2024 years ago) | no data (2024 years ago) |
Detailed specifications
Celeron M 360 and VIA C3-M C3-M-1500 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
Physical cores | 1 (Single-Core) | 1 (Single-Core) |
Threads | 1 | 1 |
Base clock speed | 1.4 GHz | no data |
Boost clock speed | 1.4 GHz | 1.5 GHz |
Bus rate | 400 MHz | 200 MHz |
L3 cache | 1 MB L2 KB | no data |
Chip lithography | 90 nm | 130 nm |
Maximum core temperature | 100 °C | no data |
64 bit support | - | - |
Windows 11 compatibility | - | - |
VID voltage range | 1.26V, 1.004V-1.292V | no data |
Compatibility
Information on Celeron M 360 and VIA C3-M C3-M-1500 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
Socket | PPGA478, H-PBGA479 | no data |
Power consumption (TDP) | 21 Watt | 12 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Celeron M 360 and VIA C3-M C3-M-1500. You'll probably need this information if you require some particular technology.
Enhanced SpeedStep (EIST) | - | no data |
Turbo Boost Technology | - | no data |
Hyper-Threading Technology | - | no data |
Idle States | - | no data |
Demand Based Switching | - | no data |
PAE | 32 Bit | no data |
FSB parity | - | no data |
Security technologies
Celeron M 360 and VIA C3-M C3-M-1500 technologies aimed at improving security, for example, by protecting against hacks.
TXT | - | no data |
EDB | + | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by Celeron M 360 and VIA C3-M C3-M-1500 are enumerated here.
VT-x | - | no data |
Pros & cons summary
Chip lithography | 90 nm | 130 nm |
Power consumption (TDP) | 21 Watt | 12 Watt |
Celeron M 360 has a 44.4% more advanced lithography process.
VIA C3-M C3-M-1500, on the other hand, has 75% lower power consumption.
We couldn't decide between Celeron M 360 and VIA C3-M C3-M-1500. We've got no test results to judge.
Should you still have questions on choice between Celeron M 360 and VIA C3-M C3-M-1500, ask them in Comments section, and we shall answer.
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