VIA C3-M C3-M-1200 vs Celeron 900
Primary details
Comparing Celeron 900 and VIA C3-M C3-M-1200 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | not rated | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Laptop | Laptop |
| Series | no data | C3-M |
| Architecture codename | no data | Nehemiah |
| Release date | 1 January 2009 (15 years ago) | no data |
Detailed specifications
Celeron 900 and VIA C3-M C3-M-1200 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | no data | 1 (Single-Core) |
| Threads | no data | 1 |
| Base clock speed | 2.2 GHz | no data |
| Boost clock speed | no data | 1.2 GHz |
| Bus rate | no data | 200 MHz |
| L3 cache | 1 MB L2 Cache | no data |
| Chip lithography | 45 nm | 130 nm |
| Maximum core temperature | 105 °C | no data |
| 64 bit support | + | - |
| Windows 11 compatibility | - | - |
Compatibility
Information on Celeron 900 and VIA C3-M C3-M-1200 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Socket | PGA478 | no data |
| Power consumption (TDP) | 35 Watt | 18 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Celeron 900 and VIA C3-M C3-M-1200. You'll probably need this information if you require some particular technology.
| Enhanced SpeedStep (EIST) | - | no data |
| Turbo Boost Technology | - | no data |
| Hyper-Threading Technology | - | no data |
| Status | Discontinued | no data |
Security technologies
Celeron 900 and VIA C3-M C3-M-1200 technologies aimed at improving security, for example, by protecting against hacks.
| TXT | - | no data |
| EDB | + | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by Celeron 900 and VIA C3-M C3-M-1200 are enumerated here.
| VT-x | - | no data |
Pros & cons summary
| Chip lithography | 45 nm | 130 nm |
| Power consumption (TDP) | 35 Watt | 18 Watt |
Celeron 900 has a 188.9% more advanced lithography process.
VIA C3-M C3-M-1200, on the other hand, has 94.4% lower power consumption.
We couldn't decide between Celeron 900 and VIA C3-M C3-M-1200. We've got no test results to judge.
Should you still have questions on choice between Celeron 900 and VIA C3-M C3-M-1200, ask them in Comments section, and we shall answer.
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