Ryzen 3 3200G vs Sempron LE-1250
Aggregate performance score
Ryzen 3 3200G outperforms Sempron LE-1250 by a whopping 2258% based on our aggregate benchmark results.
Primary details
Comparing Sempron LE-1250 and Ryzen 3 3200G processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 3250 | 1327 |
| Place by popularity | not in top-100 | 43 |
| Cost-effectiveness evaluation | no data | 8.90 |
| Market segment | Desktop processor | Desktop processor |
| Series | no data | AMD Ryzen 3 |
| Power efficiency | 0.40 | 6.52 |
| Architecture codename | Sparta (2007) | Picasso (2019−2022) |
| Release date | October 2007 (17 years ago) | 7 July 2019 (5 years ago) |
| Launch price (MSRP) | $29 | $99 |
Cost-effectiveness evaluation
Performance per price, higher is better.
Detailed specifications
Sempron LE-1250 and Ryzen 3 3200G basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 1 (Single-Core) | 4 (Quad-Core) |
| Threads | 1 | 4 |
| Base clock speed | no data | 3.6 GHz |
| Boost clock speed | 2.2 GHz | 4 GHz |
| Bus type | no data | PCIe 3.0 |
| Multiplier | no data | 36 |
| L1 cache | 128 KB | 96 KB (per core) |
| L2 cache | 512 KB | 512 KB (per core) |
| L3 cache | 0 KB | 4 MB (shared) |
| Chip lithography | 65 nm | 12 nm |
| Die size | no data | 210 mm2 |
| Number of transistors | no data | 4,940 million |
| 64 bit support | + | + |
| Windows 11 compatibility | - | + |
| Unlocked multiplier | - | + |
Compatibility
Information on Sempron LE-1250 and Ryzen 3 3200G compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | 1 (Uniprocessor) |
| Socket | AM2 | AM4 |
| Power consumption (TDP) | 45 Watt | 65 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Sempron LE-1250 and Ryzen 3 3200G. You'll probably need this information if you require some particular technology.
| AES-NI | - | + |
| AVX | - | + |
Virtualization technologies
Virtual machine speed-up technologies supported by Sempron LE-1250 and Ryzen 3 3200G are enumerated here.
| AMD-V | - | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Sempron LE-1250 and Ryzen 3 3200G. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | no data | DDR4 Dual-channel |
| Maximum memory size | no data | 64 GB |
| Max memory channels | no data | 2 |
| Maximum memory bandwidth | no data | 46.933 GB/s |
| ECC memory support | - | + |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | no data | AMD Radeon Vega 8 |
Peripherals
Specifications and connection of peripherals supported by Sempron LE-1250 and Ryzen 3 3200G.
| PCIe version | no data | 3.0 |
| PCI Express lanes | no data | 20 |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Combined synthetic benchmark score
This is our combined benchmark performance rating. We are regularly improving our combining algorithms, but if you find some perceived inconsistencies, feel free to speak up in comments section, we usually fix problems quickly.
Passmark
Passmark CPU Mark is a widespread benchmark, consisting of 8 different types of workload, including integer and floating point math, extended instructions, compression, encryption and physics calculation. There is also one separate single-threaded scenario measuring single-core performance.
Pros & cons summary
| Performance score | 0.19 | 4.48 |
| Physical cores | 1 | 4 |
| Threads | 1 | 4 |
| Chip lithography | 65 nm | 12 nm |
| Power consumption (TDP) | 45 Watt | 65 Watt |
Sempron LE-1250 has 44.4% lower power consumption.
Ryzen 3 3200G, on the other hand, has a 2257.9% higher aggregate performance score, 300% more physical cores and 300% more threads, and a 441.7% more advanced lithography process.
The Ryzen 3 3200G is our recommended choice as it beats the Sempron LE-1250 in performance tests.
Should you still have questions on choice between Sempron LE-1250 and Ryzen 3 3200G, ask them in Comments section, and we shall answer.
Similar processor comparisons
We picked several similar comparisons of processors in the same market segment and performance relatively close to those reviewed on this page.
