Ryzen 7 5825C vs Ryzen Embedded V1807B
Primary details
Comparing Ryzen Embedded V1807B and Ryzen 7 5825C processor market type (desktop or notebook), architecture, sales start time and price.
Place in the ranking | 1170 | not rated |
Place by popularity | not in top-100 | not in top-100 |
Market segment | Desktop processor | Laptop |
Series | AMD Ryzen Embedded | AMD Cezanne (Zen 3, Ryzen 5000) |
Power efficiency | 11.31 | no data |
Architecture codename | Zen (2017−2020) | Barcelo (Zen 3) (2022−2023) |
Release date | 21 February 2018 (6 years ago) | 5 May 2022 (2 years ago) |
Detailed specifications
Ryzen Embedded V1807B and Ryzen 7 5825C basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
Physical cores | 4 (Quad-Core) | 8 (Octa-Core) |
Threads | 8 | 16 |
Base clock speed | 3.35 GHz | 2 GHz |
Boost clock speed | 3.8 GHz | 4.5 GHz |
Multiplier | 33.5 | no data |
L1 cache | 128K (per core) | 64K (per core) |
L2 cache | 512K (per core) | 512K (per core) |
L3 cache | 2 MB (shared) | 16 MB (shared) |
Chip lithography | 14 nm | 7 nm |
Die size | 210 mm2 | 180 mm2 |
Maximum core temperature | no data | 95 °C |
Number of transistors | 4,950 million | 10,700 million |
64 bit support | + | + |
Windows 11 compatibility | - | + |
Compatibility
Information on Ryzen Embedded V1807B and Ryzen 7 5825C compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
Number of CPUs in a configuration | 1 (Uniprocessor) | 1 |
Socket | FP5 | FP6 |
Power consumption (TDP) | 45 Watt | 15 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Ryzen Embedded V1807B and Ryzen 7 5825C. You'll probably need this information if you require some particular technology.
Instruction set extensions | no data | XFR, FMA3, SSE 4.2, AVX2, SMT |
AES-NI | + | + |
AVX | + | + |
Precision Boost 2 | + | + |
Virtualization technologies
Virtual machine speed-up technologies supported by Ryzen Embedded V1807B and Ryzen 7 5825C are enumerated here.
AMD-V | + | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Ryzen Embedded V1807B and Ryzen 7 5825C. Depending on the motherboard, higher memory frequencies may be supported.
Supported memory types | DDR4 Dual-channel | DDR4-3200 |
Maximum memory size | 32 GB | no data |
Max memory channels | 2 | no data |
Maximum memory bandwidth | 51.196 GB/s | no data |
Graphics specifications
General parameters of integrated GPUs, if any.
Integrated graphics card Compare | AMD Radeon RX Vega 11 | AMD Radeon RX Vega 8 (Ryzen 4000/5000) ( - 2000 MHz) |
Peripherals
Specifications and connection of peripherals supported by Ryzen Embedded V1807B and Ryzen 7 5825C.
PCIe version | no data | 3.0 |
PCI Express lanes | no data | 8 |
Pros & cons summary
Integrated graphics card | 5.48 | 8.98 |
Recency | 21 February 2018 | 5 May 2022 |
Physical cores | 4 | 8 |
Threads | 8 | 16 |
Chip lithography | 14 nm | 7 nm |
Power consumption (TDP) | 45 Watt | 15 Watt |
Ryzen 7 5825C has 63.9% faster integrated GPU, an age advantage of 4 years, 100% more physical cores and 100% more threads, a 100% more advanced lithography process, and 200% lower power consumption.
We couldn't decide between Ryzen Embedded V1807B and Ryzen 7 5825C. We've got no test results to judge.
Note that Ryzen Embedded V1807B is a desktop processor while Ryzen 7 5825C is a notebook one.
Should you still have questions on choice between Ryzen Embedded V1807B and Ryzen 7 5825C, ask them in Comments section, and we shall answer.
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