E1-2200 vs Celeron U3400

Primary details

Comparing Celeron U3400 and E1-2200 processor market type (desktop or notebook), architecture, sales start time and price.

Place in the ranking	not rated	not rated
Place by popularity	not in top-100	not in top-100
Market segment	Laptop	Laptop
Series	Intel Celeron	AMD E-Series
Architecture codename	Westmere (2010−2011)	Kabini (2013−2014)
Release date	24 May 2010 (14 years ago)	5 November 2013 (11 years ago)

Detailed specifications

Celeron U3400 and E1-2200 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	2 (Dual-core)	2 (Dual-core)
Threads	2	2
Base clock speed	1.06 GHz	no data
Boost clock speed	0.07 GHz	1.05 GHz
Bus type	DMI 1.0	no data
Bus rate	1 × 2.5 GT/s	no data
Multiplier	8	no data
L1 cache	128 KB	no data
L2 cache	512 KB	1024 KB
L3 cache	2 MB	no data
Chip lithography	32 nm	28 nm
Die size	81 mm2	107 mm2
Maximum core temperature	105 °C	no data
Maximum case temperature (TCase)	no data	90 °C
Number of transistors	382 Million	no data
64 bit support	+	+
Windows 11 compatibility	-	-

Compatibility

Information on Celeron U3400 and E1-2200 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1 (Uniprocessor)	1
Socket	BGA1288	FT3
Power consumption (TDP)	18 Watt	9 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Celeron U3400 and E1-2200. You'll probably need this information if you require some particular technology.

Instruction set extensions	no data	86x SSE (1, 2, 3, 3S, 4.1, 4.2, 4A),-64, AES, AVX
AES-NI	-	+
FMA	+	FMA4
AVX	-	+
PowerNow	-	+
PowerGating	-	+
VirusProtect	-	+
Enhanced SpeedStep (EIST)	+	no data
Turbo Boost Technology	-	no data
Hyper-Threading Technology	-	no data
Idle States	+	no data
Thermal Monitoring	+	-
Flex Memory Access	+	no data
PAE	36 Bit	no data
FDI	+	no data
Fast Memory Access	+	no data

Security technologies

Celeron U3400 and E1-2200 technologies aimed at improving security, for example, by protecting against hacks.

TXT	-	no data
EDB	+	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Celeron U3400 and E1-2200 are enumerated here.

AMD-V	-	+
VT-d	-	no data
VT-x	+	no data
IOMMU 2.0	-	+

Memory specs

Types, maximum amount and channel quantity of RAM supported by Celeron U3400 and E1-2200. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR3-800	DDR3
Maximum memory size	8 GB	no data
Max memory channels	2	1
Maximum memory bandwidth	12.799 GB/s	no data

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card	Intel® HD Graphics for Previous Generation Intel® Processors	AMD Radeon HD 8210
Clear Video	+	no data
Enduro	-	+
Switchable graphics	-	+
UVD	-	+
VCE	-	+
Graphics max frequency	500 MHz	no data

Graphics interfaces

Available interfaces and connections of Celeron U3400 and E1-2200 integrated GPUs.

Number of displays supported	2	no data
DisplayPort	-	+
HDMI	-	+

Graphics API support

APIs supported by Celeron U3400 and E1-2200 integrated GPUs, sometimes API versions are included.

DirectX	no data	DirectX® 12
Vulkan	-	+

Peripherals

Specifications and connection of peripherals supported by Celeron U3400 and E1-2200.

PCIe version	2.0	2.0
PCI Express lanes	16	8

Synthetic benchmark performance

Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.

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Pros & cons summary

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Recency	24 May 2010	5 November 2013
Chip lithography	32 nm	28 nm
Power consumption (TDP)	18 Watt	9 Watt

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