Core 2 Duo T5870 vs Xeon E3-1275
Primary details
Comparing Xeon E3-1275 and Core 2 Duo T5870 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 1534 | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Cost-effectiveness evaluation | 1.01 | no data |
| Market segment | Server | Laptop |
| Series | no data | Intel Core 2 Duo |
| Power efficiency | 3.46 | no data |
| Architecture codename | Sandy Bridge (2011−2013) | Merom (2006−2008) |
| Release date | 3 April 2011 (13 years ago) | 1 October 2008 (16 years ago) |
| Launch price (MSRP) | $450 | no data |
Cost-effectiveness evaluation
Performance per price, higher is better.
Detailed specifications
Xeon E3-1275 and Core 2 Duo T5870 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 4 (Quad-Core) | 2 (Dual-core) |
| Threads | 8 | 2 |
| Base clock speed | 3.4 GHz | 2 GHz |
| Boost clock speed | 3.8 GHz | 2 GHz |
| Bus rate | no data | 800 MHz |
| L1 cache | 64 KB (per core) | no data |
| L2 cache | 256 KB (per core) | 2 MB |
| L3 cache | 8 MB (shared) | 2 MB L2 Cache |
| Chip lithography | 32 nm | 65 nm |
| Die size | 216 mm2 | 143 mm2 |
| Maximum core temperature | 73 °C | 100 °C |
| Number of transistors | 1,160 million | 291 Million |
| 64 bit support | + | + |
| Windows 11 compatibility | - | - |
| VID voltage range | no data | 1.075V-1.175V |
Compatibility
Information on Xeon E3-1275 and Core 2 Duo T5870 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | no data |
| Socket | LGA1155 | no data |
| Power consumption (TDP) | 95 Watt | 35 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Xeon E3-1275 and Core 2 Duo T5870. You'll probably need this information if you require some particular technology.
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX | no data |
| AES-NI | + | - |
| AVX | + | - |
| Enhanced SpeedStep (EIST) | + | + |
| Turbo Boost Technology | 2.0 | - |
| Hyper-Threading Technology | + | - |
| Idle States | + | no data |
| Thermal Monitoring | + | - |
| Flex Memory Access | + | no data |
| Demand Based Switching | + | - |
| FDI | + | no data |
| Fast Memory Access | + | no data |
| FSB parity | no data | - |
Security technologies
Xeon E3-1275 and Core 2 Duo T5870 technologies aimed at improving security, for example, by protecting against hacks.
| TXT | + | - |
| EDB | + | + |
| Identity Protection | + | - |
Virtualization technologies
Virtual machine speed-up technologies supported by Xeon E3-1275 and Core 2 Duo T5870 are enumerated here.
| VT-d | + | no data |
| VT-x | + | - |
| EPT | + | no data |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Xeon E3-1275 and Core 2 Duo T5870. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR3 | no data |
| Maximum memory size | 32 GB | no data |
| Max memory channels | 2 | no data |
| Maximum memory bandwidth | 21 GB/s | no data |
| ECC memory support | + | - |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | Intel HD P3000 | no data |
| Quick Sync Video | + | - |
| Clear Video HD | + | no data |
| Graphics max frequency | 1.35 GHz | no data |
| InTru 3D | + | no data |
Graphics interfaces
Available interfaces and connections of Xeon E3-1275 and Core 2 Duo T5870 integrated GPUs.
| Number of displays supported | 2 | no data |
Peripherals
Specifications and connection of peripherals supported by Xeon E3-1275 and Core 2 Duo T5870.
| PCIe version | 2.0 | no data |
| PCI Express lanes | 20 | no data |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Passmark
Passmark CPU Mark is a widespread benchmark, consisting of 8 different types of workload, including integer and floating point math, extended instructions, compression, encryption and physics calculation. There is also one separate single-threaded scenario measuring single-core performance.
Pros & cons summary
| Recency | 3 April 2011 | 1 October 2008 |
| Physical cores | 4 | 2 |
| Threads | 8 | 2 |
| Chip lithography | 32 nm | 65 nm |
| Power consumption (TDP) | 95 Watt | 35 Watt |
Xeon E3-1275 has an age advantage of 2 years, 100% more physical cores and 300% more threads, and a 103.1% more advanced lithography process.
Core 2 Duo T5870, on the other hand, has 171.4% lower power consumption.
We couldn't decide between Xeon E3-1275 and Core 2 Duo T5870. We've got no test results to judge.
Be aware that Xeon E3-1275 is a server/workstation processor while Core 2 Duo T5870 is a notebook one.
Should you still have questions on choice between Xeon E3-1275 and Core 2 Duo T5870, ask them in Comments section, and we shall answer.
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