E-350 vs Xeon E3-1265L v3

Primary details

Comparing Xeon E3-1265L v3 and E-350 processor market type (desktop or notebook), architecture, sales start time and price.

Place in the ranking	1436	not rated
Place by popularity	not in top-100	not in top-100
Cost-effectiveness evaluation	0.82	no data
Market segment	Server	Laptop
Series	no data	AMD E-Series
Power efficiency	8.24	no data
Architecture codename	Haswell-WS (2013−2014)	Zacate (2011−2013)
Release date	2 June 2013 (11 years ago)	4 January 2011 (13 years ago)
Launch price (MSRP)	$710	no data

Cost-effectiveness evaluation

Performance per price, higher is better.

Detailed specifications

Xeon E3-1265L v3 and E-350 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	4 (Quad-Core)	2 (Dual-core)
Threads	8	2
Base clock speed	2.5 GHz	no data
Boost clock speed	3.7 GHz	1.6 GHz
Bus rate	5 GT/s	no data
L1 cache	64 KB (per core)	64K (per core)
L2 cache	256 KB (per core)	512K (per core)
L3 cache	8192 KB (shared)	0 KB
Chip lithography	22 nm	40 nm
Die size	160 mm2	75 mm2
Maximum core temperature	no data	90 °C
Number of transistors	1,400 million	no data
64 bit support	+	+
Windows 11 compatibility	-	-

Compatibility

Information on Xeon E3-1265L v3 and E-350 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1	1
Socket	FCLGA1150	FT1
Power consumption (TDP)	45 Watt	18 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Xeon E3-1265L v3 and E-350. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2	MMX (+), SSE, SSE2, SSE3, SSSE3, SSE4A
AES-NI	+	-
AVX	+	-
vPro	+	no data
Enhanced SpeedStep (EIST)	+	no data
Turbo Boost Technology	2.0	no data
Hyper-Threading Technology	+	no data
TSX	+	-
Idle States	+	no data
Thermal Monitoring	+	-
Flex Memory Access	+	no data
SIPP	+	-
FDI	+	no data
Fast Memory Access	+	no data

Security technologies

Xeon E3-1265L v3 and E-350 technologies aimed at improving security, for example, by protecting against hacks.

TXT	+	no data
EDB	+	no data
Secure Key	+	no data
Identity Protection	+	-
OS Guard	+	no data
Anti-Theft	+	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Xeon E3-1265L v3 and E-350 are enumerated here.

AMD-V	-	+
VT-d	+	no data
VT-x	+	no data
EPT	+	no data

Memory specs

Types, maximum amount and channel quantity of RAM supported by Xeon E3-1265L v3 and E-350. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR3, DDR4	DDR3
Maximum memory size	32 GB	no data
Max memory channels	2	no data
Maximum memory bandwidth	25.6 GB/s	no data
ECC memory support	+	-

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card	Intel® HD Graphics for 4th Generation Intel® Processors	AMD Radeon HD 6310
Quick Sync Video	+	-
Clear Video HD	+	no data
Graphics max frequency	1.2 GHz	no data
InTru 3D	+	no data

Graphics interfaces

Available interfaces and connections of Xeon E3-1265L v3 and E-350 integrated GPUs.

Number of displays supported

3

no data

Peripherals

Specifications and connection of peripherals supported by Xeon E3-1265L v3 and E-350.

PCIe version	3.0	no data
PCI Express lanes	16	no data

Synthetic benchmark performance

Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.

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Pros & cons summary

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Recency	2 June 2013	4 January 2011
Physical cores	4	2
Threads	8	2
Chip lithography	22 nm	40 nm
Power consumption (TDP)	45 Watt	18 Watt

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