Mobile Sempron 3300+ vs Xeon E3-1245

Primary details

Comparing Xeon E3-1245 and Mobile Sempron 3300+ processor market type (desktop or notebook), architecture, sales start time and price.

Place in the ranking	1565	3242
Place by popularity	not in top-100	not in top-100
Cost-effectiveness evaluation	1.30	no data
Market segment	Server	Laptop
Series	no data	AMD Mobile Sempron
Power efficiency	3.35	0.29
Architecture codename	Sandy Bridge (2011−2013)	Roma (2005)
Release date	3 April 2011 (13 years ago)	1 June 2005 (19 years ago)
Launch price (MSRP)	$350	no data

Cost-effectiveness evaluation

Performance per price, higher is better.

Detailed specifications

Xeon E3-1245 and Mobile Sempron 3300+ basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	4 (Quad-Core)	1 (Single-Core)
Threads	8	1
Base clock speed	3.3 GHz	no data
Boost clock speed	3.7 GHz	2 GHz
Bus rate	no data	800 MHz
L1 cache	64 KB (per core)	no data
L2 cache	256 KB (per core)	128 KB
L3 cache	8 MB (shared)	no data
Chip lithography	32 nm	90 nm
Die size	216 mm2	no data
Maximum core temperature	73 °C	no data
Number of transistors	1,160 million	no data
64 bit support	+	-
Windows 11 compatibility	-	-

Compatibility

Information on Xeon E3-1245 and Mobile Sempron 3300+ compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1	no data
Socket	LGA1155	745
Power consumption (TDP)	95 Watt	62/25 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Xeon E3-1245 and Mobile Sempron 3300+. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX	MMX, SSE, SSE2, SSE3 (Roma Core), Enhanced 3DNow!, NX bit
AES-NI	+	-
AVX	+	-
Enhanced SpeedStep (EIST)	+	no data
Turbo Boost Technology	2.0	no data
Hyper-Threading Technology	+	no data
Idle States	+	no data
Thermal Monitoring	+	-
Flex Memory Access	+	no data
Demand Based Switching	+	no data
FDI	+	no data
Fast Memory Access	+	no data

Security technologies

Xeon E3-1245 and Mobile Sempron 3300+ technologies aimed at improving security, for example, by protecting against hacks.

TXT	+	no data
EDB	+	no data
Identity Protection	+	-

Virtualization technologies

Virtual machine speed-up technologies supported by Xeon E3-1245 and Mobile Sempron 3300+ are enumerated here.

VT-d	+	no data
VT-x	+	no data
EPT	+	no data

Memory specs

Types, maximum amount and channel quantity of RAM supported by Xeon E3-1245 and Mobile Sempron 3300+. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR3	no data
Maximum memory size	32 GB	no data
Max memory channels	2	no data
Maximum memory bandwidth	21 GB/s	no data
ECC memory support	+	-

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card	Intel HD P3000	no data
Quick Sync Video	+	-
Clear Video HD	+	no data
Graphics max frequency	1.35 GHz	no data
InTru 3D	+	no data

Graphics interfaces

Available interfaces and connections of Xeon E3-1245 and Mobile Sempron 3300+ integrated GPUs.

Number of displays supported

2

no data

Peripherals

Specifications and connection of peripherals supported by Xeon E3-1245 and Mobile Sempron 3300+.

PCIe version	2.0	no data
PCI Express lanes	20	no data

Synthetic benchmark performance

Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.

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Combined synthetic benchmark score

This is our combined benchmark performance rating. We are regularly improving our combining algorithms, but if you find some perceived inconsistencies, feel free to speak up in comments section, we usually fix problems quickly.

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Pros & cons summary

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Performance score	3.36	0.19
Recency	3 April 2011	1 June 2005
Physical cores	4	1
Threads	8	1
Chip lithography	32 nm	90 nm
Power consumption (TDP)	95 Watt	62 Watt

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Should you still have questions on choice between Xeon E3-1245 and Mobile Sempron 3300+, ask them in Comments section, and we shall answer.

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