EPYC 9335 vs Xeon E3-1230 v6

Primary details

Comparing Xeon E3-1230 v6 and EPYC 9335 processor market type (desktop or notebook), architecture, sales start time and price.

Place in the ranking	1191	not rated
Place by popularity	not in top-100	not in top-100
Cost-effectiveness evaluation	6.79	no data
Market segment	Server	Server
Series	Intel Xeon E3	no data
Power efficiency	6.80	no data
Architecture codename	Kaby Lake (2016−2019)	Turin (2024)
Release date	28 March 2017 (7 years ago)	10 October 2024 (less than a year ago)
Launch price (MSRP)	$250	$3,178

Cost-effectiveness evaluation

Performance per price, higher is better.

Detailed specifications

Xeon E3-1230 v6 and EPYC 9335 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	4 (Quad-Core)	32 (Dotriaconta-Core)
Threads	8	64
Base clock speed	3.5 GHz	3 GHz
Boost clock speed	3.9 GHz	4.4 GHz
Bus type	DMI 3.0	no data
Bus rate	8 GT/s	no data
Multiplier	35	no data
L1 cache	256 KB	80 KB (per core)
L2 cache	1 MB	1 MB (per core)
L3 cache	8 MB	128 MB (shared)
Chip lithography	14 nm	4 nm
Die size	no data	4x 70.6 mm2
Number of transistors	no data	33,260 million
64 bit support	+	+
Windows 11 compatibility	-	no data

Compatibility

Information on Xeon E3-1230 v6 and EPYC 9335 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1 (Uniprocessor)	2
Socket	FCLGA1151	SP5
Power consumption (TDP)	72 Watt	210 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Xeon E3-1230 v6 and EPYC 9335. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2	no data
AES-NI	+	+
AVX	+	+
vPro	+	no data
Enhanced SpeedStep (EIST)	+	no data
Turbo Boost Technology	2.0	no data
Hyper-Threading Technology	+	no data
TSX	+	-
Idle States	+	no data
Thermal Monitoring	+	-
Precision Boost 2	no data	+

Security technologies

Xeon E3-1230 v6 and EPYC 9335 technologies aimed at improving security, for example, by protecting against hacks.

TXT	+	no data
EDB	+	no data
Secure Key	+	no data
MPX	+	-
SGX	Yes with both Intel® SPS and Intel® ME	no data
OS Guard	+	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Xeon E3-1230 v6 and EPYC 9335 are enumerated here.

AMD-V	-	+
VT-d	+	no data
VT-x	+	no data
EPT	+	no data

Memory specs

Types, maximum amount and channel quantity of RAM supported by Xeon E3-1230 v6 and EPYC 9335. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR4-2400, DDR3L-1866	DDR5
Maximum memory size	64 GB	no data
Max memory channels	2	no data
Maximum memory bandwidth	38.397 GB/s	no data
ECC memory support	+	-

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card

no data

N/A

Graphics image quality

Maximum display resolutions supported by Xeon E3-1230 v6 and EPYC 9335 integrated GPUs, including resolutions over different interfaces.

Max resolution over HDMI 1.4	N/A	no data
Max resolution over eDP	N/A	no data
Max resolution over DisplayPort	N/A	no data
Max resolution over VGA	N/A	no data

Graphics API support

APIs supported by Xeon E3-1230 v6 and EPYC 9335 integrated GPUs, sometimes API versions are included.

DirectX	N/A	no data
OpenGL	N/A	no data

Peripherals

Specifications and connection of peripherals supported by Xeon E3-1230 v6 and EPYC 9335.

PCIe version	3.0	5.0
PCI Express lanes	16	128

Pros & cons summary

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Recency	28 March 2017	10 October 2024
Physical cores	4	32
Threads	8	64
Chip lithography	14 nm	4 nm
Power consumption (TDP)	72 Watt	210 Watt

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