Ultra 7 266V vs Xeon E-2234

Primary details

Comparing Xeon E-2234 and Core Ultra 7 266V processor market type (desktop or notebook), architecture, sales start time and price.

Place in the ranking	1122	not rated
Place by popularity	not in top-100	not in top-100
Cost-effectiveness evaluation	24.90	no data
Market segment	Server	Laptop
Series	Intel Xeon E	no data
Power efficiency	7.65	no data
Architecture codename	Coffee Lake-S WS (2018−2019)	Lunar Lake (2024)
Release date	29 May 2019 (5 years ago)	24 September 2024 (less than a year ago)
Launch price (MSRP)	$250	no data

Cost-effectiveness evaluation

Performance per price, higher is better.

Detailed specifications

Xeon E-2234 and Core Ultra 7 266V basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	4 (Quad-Core)	8 (Octa-Core)
Threads	8	8
Base clock speed	3.6 GHz	2.2 GHz
Boost clock speed	4.8 GHz	5 GHz
Bus type	DMI 3.0	no data
Bus rate	4 × 8 GT/s	37 MHz
Multiplier	36	no data
L1 cache	64 KB (per core)	192 KB (per core)
L2 cache	256 KB (per core)	2.5 MB (per core)
L3 cache	8 MB (shared)	12 MB (shared)
Chip lithography	14 nm	3 nm
Die size	126 mm2	no data
Maximum core temperature	100 °C	100 °C
64 bit support	+	+
Windows 11 compatibility	+	no data

Compatibility

Information on Xeon E-2234 and Core Ultra 7 266V compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1 (Uniprocessor)	1
Socket	FCLGA1151	Intel BGA 2833
Power consumption (TDP)	71 Watt	17 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Xeon E-2234 and Core Ultra 7 266V. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2	no data
AES-NI	+	+
AVX	+	+
vPro	+	no data
Enhanced SpeedStep (EIST)	+	+
Turbo Boost Technology	2.0	no data
Hyper-Threading Technology	+	no data
TSX	+	+
Idle States	+	no data
Thermal Monitoring	+	-

Security technologies

Xeon E-2234 and Core Ultra 7 266V technologies aimed at improving security, for example, by protecting against hacks.

TXT	+	+
EDB	+	no data
Secure Key	+	no data
MPX	+	-
SGX	Yes with Intel® ME	no data
OS Guard	+	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Xeon E-2234 and Core Ultra 7 266V are enumerated here.

VT-d	+	+
VT-x	+	+
EPT	+	no data

Memory specs

Types, maximum amount and channel quantity of RAM supported by Xeon E-2234 and Core Ultra 7 266V. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR4-2666	DDR5
Maximum memory size	128 GB	no data
Max memory channels	2	no data
Maximum memory bandwidth	42.671 GB/s	no data
ECC memory support	+	-

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card

Intel UHD Graphics P630

Arc 140V

Graphics image quality

Maximum display resolutions supported by Xeon E-2234 and Core Ultra 7 266V integrated GPUs, including resolutions over different interfaces.

Max resolution over HDMI 1.4	N/A	no data
Max resolution over eDP	N/A	no data
Max resolution over DisplayPort	N/A	no data
Max resolution over VGA	N/A	no data

Graphics API support

APIs supported by Xeon E-2234 and Core Ultra 7 266V integrated GPUs, sometimes API versions are included.

DirectX	N/A	no data
OpenGL	N/A	no data

Peripherals

Specifications and connection of peripherals supported by Xeon E-2234 and Core Ultra 7 266V.

PCIe version	3.0	5.0
PCI Express lanes	16	4

Pros & cons summary

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Recency	29 May 2019	24 September 2024
Physical cores	4	8
Chip lithography	14 nm	3 nm
Power consumption (TDP)	71 Watt	17 Watt

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