Ryzen AI 9 HX PRO 370 vs Xeon D-2796TE
Primary details
Comparing Xeon D-2796TE and Ryzen AI 9 HX PRO 370 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 400 | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Cost-effectiveness evaluation | 18.95 | no data |
| Market segment | Server | Laptop |
| Series | no data | Strix Point (Zen 5/5c, Ryzen AI 3/5/7/9) |
| Power efficiency | 13.27 | no data |
| Architecture codename | Ice Lake-D (2022−2023) | Strix Point-HX PRO (Zen 5/5c) (2025) |
| Release date | 24 February 2022 (2 years ago) | January 2025 (recently) |
| Launch price (MSRP) | $2,101 | no data |
Cost-effectiveness evaluation
Performance per price, higher is better.
Detailed specifications
Xeon D-2796TE and Ryzen AI 9 HX PRO 370 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 20 (Icosa-Core) | 12 (Dodeca-Core) |
| Performance-cores | 20 | no data |
| Threads | 40 | 24 |
| Base clock speed | 2 GHz | 2 GHz |
| Boost clock speed | 3.1 GHz | 5.1 GHz |
| Bus rate | no data | 54 MHz |
| L1 cache | 80 KB (per core) | 80 KB (per core) |
| L2 cache | 1.25 MB (per core) | 1 MB (per core) |
| L3 cache | 30 MB (shared) | 16 MB |
| Chip lithography | 10 nm | 4 nm |
| 64 bit support | + | - |
| Windows 11 compatibility | + | no data |
Compatibility
Information on Xeon D-2796TE and Ryzen AI 9 HX PRO 370 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | 1 |
| Socket | FCBGA2579 | FP8 |
| Power consumption (TDP) | 118 Watt | 28 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Xeon D-2796TE and Ryzen AI 9 HX PRO 370. You'll probably need this information if you require some particular technology.
| Instruction set extensions | Intel® AVX-512 | USB 4, XDNA 2 NPU (50 TOPS), SMT, AES, AVX, AVX2, AVX512, FMA3, MMX+, SHA, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A |
| AES-NI | + | + |
| AVX | + | + |
| Enhanced SpeedStep (EIST) | + | no data |
| QuickAssist | - | no data |
| Turbo Boost Technology | 2.0 | no data |
| Hyper-Threading Technology | + | no data |
| Thermal Monitoring | + | - |
| Precision Boost 2 | no data | + |
| Deep Learning Boost | + | - |
Security technologies
Xeon D-2796TE and Ryzen AI 9 HX PRO 370 technologies aimed at improving security, for example, by protecting against hacks.
| TXT | + | no data |
| EDB | + | no data |
| SGX | Yes with Intel® SPS | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by Xeon D-2796TE and Ryzen AI 9 HX PRO 370 are enumerated here.
| AMD-V | - | + |
| VT-d | + | no data |
| VT-x | + | no data |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Xeon D-2796TE and Ryzen AI 9 HX PRO 370. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR4 | DDR5 |
| Maximum memory size | 1 TB | no data |
| Max memory channels | 4 | no data |
| ECC memory support | + | - |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | N/A | AMD Radeon 890M ( - 2900 MHz) |
Peripherals
Specifications and connection of peripherals supported by Xeon D-2796TE and Ryzen AI 9 HX PRO 370.
| PCIe version | 4.0 | 4.0 |
| PCI Express lanes | 32 | 16 |
| USB revision | 3.0 | no data |
| Max number of SATA 6 Gb/s Ports | 24 | no data |
| Number of USB ports | 4 | no data |
| Integrated LAN | + | no data |
Pros & cons summary
| Physical cores | 20 | 12 |
| Threads | 40 | 24 |
| Chip lithography | 10 nm | 4 nm |
| Power consumption (TDP) | 118 Watt | 28 Watt |
Xeon D-2796TE has 66.7% more physical cores and 66.7% more threads.
Ryzen AI 9 HX PRO 370, on the other hand, has a 150% more advanced lithography process, and 321.4% lower power consumption.
We couldn't decide between Xeon D-2796TE and Ryzen AI 9 HX PRO 370. We've got no test results to judge.
Be aware that Xeon D-2796TE is a server/workstation processor while Ryzen AI 9 HX PRO 370 is a notebook one.
Should you still have questions on choice between Xeon D-2796TE and Ryzen AI 9 HX PRO 370, ask them in Comments section, and we shall answer.
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