EPYC Embedded 3301 vs Xeon 3.0
Primary details
Comparing Xeon 3.0 and EPYC Embedded 3301 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in performance ranking | not rated | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Server | Server |
| Series | no data | AMD EPYC Embedded |
| Architecture codename | Irwindale (2004) | Zen (2017−2020) |
| Release date | June 2004 (20 years ago) | 21 February 2018 (6 years ago) |
| Launch price (MSRP) | no data | $450 |
Detailed specifications
Xeon 3.0 and EPYC Embedded 3301 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 1 (Single-Core) | 12 (Dodeca-Core) |
| Threads | 1 | 12 |
| Boost clock speed | 3 GHz | 2 GHz |
| L1 cache | 16 KB | 1152 KB |
| L2 cache | 2 MB | 6 MB |
| L3 cache | 0 KB | 32 MB |
| Chip lithography | 90 nm | 14 nm |
| Die size | 169 mm2 | 213 mm2 |
| Number of transistors | 178 million | 9600 Million |
| 64 bit support | + | + |
| Windows 11 compatibility | - | - |
| Unlocked multiplier | No | No |
Compatibility
Information on Xeon 3.0 and EPYC Embedded 3301 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | 1 (Uniprocessor) |
| Socket | 604 | no data |
| Power consumption (TDP) | 135 Watt | 65 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Xeon 3.0 and EPYC Embedded 3301. You'll probably need this information if you require some particular technology.
| AES-NI | no data | + |
| AVX | no data | + |
| Enhanced SpeedStep (EIST) | + | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by Xeon 3.0 and EPYC Embedded 3301 are enumerated here.
| AMD-V | no data | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Xeon 3.0 and EPYC Embedded 3301. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | no data | DDR4-2666 |
| Maximum memory size | no data | 1 TiB |
| Max memory channels | no data | 4 |
| Maximum memory bandwidth | no data | 85.33 GB/s |
| ECC memory support | no data | + |
Pros & cons summary
| Physical cores | 1 | 12 |
| Threads | 1 | 12 |
| Chip lithography | 90 nm | 14 nm |
| Power consumption (TDP) | 135 Watt | 65 Watt |
EPYC Embedded 3301 has 1100% more physical cores and 1100% more threads, a 542.9% more advanced lithography process, and 107.7% lower power consumption.
We couldn't decide between Xeon 3.0 and EPYC Embedded 3301. We've got no test results to judge.
Should you still have questions on choice between Xeon 3.0 and EPYC Embedded 3301, ask them in Comments section, and we shall answer.
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