Ultra 7 265F vs VIA 1.1GigaPro (C3 800A)

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Primary details

Comparing VIA 1.1GigaPro (C3 800A) and Core Ultra 7 265F processor market type (desktop or notebook), architecture, sales start time and price.

Place in the rankingnot ratednot rated
Place by popularitynot in top-100not in top-100
Market segmentDesktop processorDesktop processor
Architecture codenameSamuel 2 (2001)Arrow Lake-S (2024−2025)
Release date11 September 2001 (23 years ago)January 2025

Detailed specifications

VIA 1.1GigaPro (C3 800A) and Core Ultra 7 265F basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores1 (Single-Core)20 (Icosa-Core)
Threads120
Base clock speedno data2.4 GHz
Boost clock speed0.8 GHz5.3 GHz
L1 cache128 KB112 KB (per core)
L2 cache64 KB3 MB (per core)
L3 cacheno data30 MB (shared)
Chip lithography150 nm3 nm
Die size52 mm2243 mm2
Number of transistors16 million17,800 million
64 bit support-+

Compatibility

Information on VIA 1.1GigaPro (C3 800A) and Core Ultra 7 265F compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration11
SocketVIA BGA 3681851
Power consumption (TDP)11 Watt65 Watt

Technologies and extensions

Technological solutions and additional instructions supported by VIA 1.1GigaPro (C3 800A) and Core Ultra 7 265F. You'll probably need this information if you require some particular technology.

AES-NI-+
AVX-+
Enhanced SpeedStep (EIST)no data+
TSX-+

Security technologies

VIA 1.1GigaPro (C3 800A) and Core Ultra 7 265F technologies aimed at improving security, for example, by protecting against hacks.

TXTno data+

Virtualization technologies

Virtual machine speed-up technologies supported by VIA 1.1GigaPro (C3 800A) and Core Ultra 7 265F are enumerated here.

VT-dno data+
VT-xno data+

Memory specs

Types, maximum amount and channel quantity of RAM supported by VIA 1.1GigaPro (C3 800A) and Core Ultra 7 265F. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory typesunknownDDR5

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics cardOn certain motherboards (Chipset feature)N/A

Peripherals

Specifications and connection of peripherals supported by VIA 1.1GigaPro (C3 800A) and Core Ultra 7 265F.

PCIe versionno data5.0
PCI Express lanesno data20

Pros & cons summary


Physical cores 1 20
Threads 1 20
Chip lithography 150 nm 3 nm
Power consumption (TDP) 11 Watt 65 Watt

VIA 1.1GigaPro (C3 800A) has 490.9% lower power consumption.

Ultra 7 265F, on the other hand, has 1900% more physical cores and 1900% more threads, and a 4900% more advanced lithography process.

We couldn't decide between VIA 1.1GigaPro (C3 800A) and Core Ultra 7 265F. We've got no test results to judge.


Should you still have questions on choice between VIA 1.1GigaPro (C3 800A) and Core Ultra 7 265F, ask them in Comments section, and we shall answer.

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VIA 1.1GigaPro (C3 800A)
1.1GigaPro (C3 800A)
Intel Core Ultra 7 265F
Core Ultra 7 265F

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