Ryzen AI 9 HX 170 vs Sempron 3400+ EE SFF
Primary details
Comparing Sempron 3400+ EE SFF and Ryzen AI 9 HX 170 processor market type (desktop or notebook), architecture, sales start time and price.
Place in the ranking | not rated | not rated |
Place by popularity | not in top-100 | not in top-100 |
Market segment | Desktop processor | Laptop |
Series | no data | AMD Strix Point (Zen 5/5c, Ryzen AI 3/5/7/9) |
Architecture codename | Manila (2001−2006) | Strix Point-HX (Zen 5) (2024) |
Release date | May 2006 (18 years ago) | 4 June 2024 (less than a year ago) |
Detailed specifications
Sempron 3400+ EE SFF and Ryzen AI 9 HX 170 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
Physical cores | 1 (Single-Core) | 12 (Dodeca-Core) |
Threads | 1 | 24 |
Boost clock speed | 1.8 GHz | 5.1 GHz |
L1 cache | 128 KB | no data |
L2 cache | 256 KB | no data |
L3 cache | 0 KB | 36 MB |
Chip lithography | 90 nm | 3 nm |
Die size | 103 mm2 | no data |
Number of transistors | 81 million | no data |
64 bit support | + | + |
Windows 11 compatibility | - | no data |
Compatibility
Information on Sempron 3400+ EE SFF and Ryzen AI 9 HX 170 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
Number of CPUs in a configuration | 1 | no data |
Socket | AM2 | no data |
Power consumption (TDP) | 35 Watt | 55 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Sempron 3400+ EE SFF and Ryzen AI 9 HX 170. You'll probably need this information if you require some particular technology.
Instruction set extensions | no data | XDNA 2 NPU |
Pros & cons summary
Physical cores | 1 | 12 |
Threads | 1 | 24 |
Chip lithography | 90 nm | 3 nm |
Power consumption (TDP) | 35 Watt | 55 Watt |
Sempron 3400+ EE SFF has 57.1% lower power consumption.
Ryzen AI 9 HX 170, on the other hand, has 1100% more physical cores and 2300% more threads, and a 2900% more advanced lithography process.
We couldn't decide between Sempron 3400+ EE SFF and Ryzen AI 9 HX 170. We've got no test results to judge.
Note that Sempron 3400+ EE SFF is a desktop processor while Ryzen AI 9 HX 170 is a notebook one.
Should you still have questions on choice between Sempron 3400+ EE SFF and Ryzen AI 9 HX 170, ask them in Comments section, and we shall answer.
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