Ultra 7 265 vs Sempron 3200+ EE SFF

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Primary details

Comparing Sempron 3200+ EE SFF and Core Ultra 7 265 processor market type (desktop or notebook), architecture, sales start time and price.

Place in the rankingnot ratednot rated
Place by popularitynot in top-100not in top-100
Market segmentDesktop processorDesktop processor
Architecture codenameManila (2001−2006)Arrow Lake-S (2024−2025)
Release dateMay 2006 (18 years ago)January 2025

Detailed specifications

Sempron 3200+ EE SFF and Core Ultra 7 265 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores1 (Single-Core)20 (Icosa-Core)
Threads120
Base clock speedno data2.4 GHz
Boost clock speed1.8 GHz5.3 GHz
L1 cache128 KB112 KB (per core)
L2 cache128 KB3 MB (per core)
L3 cache0 KB30 MB (shared)
Chip lithography90 nm3 nm
Die size103 mm2243 mm2
Number of transistors81 million17,800 million
64 bit support++
Windows 11 compatibility-no data

Compatibility

Information on Sempron 3200+ EE SFF and Core Ultra 7 265 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration11
SocketAM21851
Power consumption (TDP)35 Watt65 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Sempron 3200+ EE SFF and Core Ultra 7 265. You'll probably need this information if you require some particular technology.

AES-NI-+
AVX-+
vProno data+
Enhanced SpeedStep (EIST)no data+
TSX-+

Security technologies

Sempron 3200+ EE SFF and Core Ultra 7 265 technologies aimed at improving security, for example, by protecting against hacks.

TXTno data+

Virtualization technologies

Virtual machine speed-up technologies supported by Sempron 3200+ EE SFF and Core Ultra 7 265 are enumerated here.

VT-dno data+
VT-xno data+

Memory specs

Types, maximum amount and channel quantity of RAM supported by Sempron 3200+ EE SFF and Core Ultra 7 265. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory typesno dataDDR5

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics cardno dataArc Xe2 Graphics 64EU

Peripherals

Specifications and connection of peripherals supported by Sempron 3200+ EE SFF and Core Ultra 7 265.

PCIe versionno data5.0
PCI Express lanesno data20

Pros & cons summary


Physical cores 1 20
Threads 1 20
Chip lithography 90 nm 3 nm
Power consumption (TDP) 35 Watt 65 Watt

Sempron 3200+ EE SFF has 85.7% lower power consumption.

Ultra 7 265, on the other hand, has 1900% more physical cores and 1900% more threads, and a 2900% more advanced lithography process.

We couldn't decide between Sempron 3200+ EE SFF and Core Ultra 7 265. We've got no test results to judge.


Should you still have questions on choice between Sempron 3200+ EE SFF and Core Ultra 7 265, ask them in Comments section, and we shall answer.

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AMD Sempron 3200+ EE SFF
Sempron 3200+ EE SFF
Intel Core Ultra 7 265
Core Ultra 7 265

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Community ratings

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