VIA C3-M C3-M-1200 vs Ryzen AI 9 HX 375

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Primary details

Comparing Ryzen AI 9 HX 375 and VIA C3-M C3-M-1200 processor market type (desktop or notebook), architecture, sales start time and price.

Place in the ranking291not rated
Place by popularitynot in top-100not in top-100
Market segmentLaptopLaptop
SeriesAMD Strix Point (Zen 5/5c, Ryzen AI 3/5/7/9)C3-M
Power efficiency34.31no data
Architecture codenameStrix Point-HX (Zen 5) (2024)Nehemiah
Release date25 July 2024 (less than a year ago)no data (2024 years ago)

Detailed specifications

Ryzen AI 9 HX 375 and VIA C3-M C3-M-1200 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores12 (Dodeca-Core)1 (Single-Core)
Threads241
Base clock speed2 GHzno data
Boost clock speed5.1 GHz1.2 GHz
Bus rateno data200 MHz
L2 cache12 MBno data
L3 cache24 MBno data
Chip lithography4 nm130 nm
Maximum core temperature100 °Cno data
64 bit support+-
Windows 11 compatibilityno data-

Compatibility

Information on Ryzen AI 9 HX 375 and VIA C3-M C3-M-1200 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

SocketFP8no data
Power consumption (TDP)54 Watt18 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Ryzen AI 9 HX 375 and VIA C3-M C3-M-1200. You'll probably need this information if you require some particular technology.

Instruction set extensionsUSB 4, XDNA 2 NPU (55 TOPS), SMT, AES, AVX, AVX2, AVX512, FMA3, MMX (+), SHA, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4Ano data
AES-NI+-
AVX+-

Memory specs

Types, maximum amount and channel quantity of RAM supported by Ryzen AI 9 HX 375 and VIA C3-M C3-M-1200. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory typesDDR5no data

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics cardAMD Radeon 890M ( - 2900 MHz)no data

Pros & cons summary


Physical cores 12 1
Threads 24 1
Chip lithography 4 nm 130 nm
Power consumption (TDP) 54 Watt 18 Watt

Ryzen AI 9 HX 375 has 1100% more physical cores and 2300% more threads, and a 3150% more advanced lithography process.

VIA C3-M C3-M-1200, on the other hand, has 200% lower power consumption.

We couldn't decide between Ryzen AI 9 HX 375 and VIA C3-M C3-M-1200. We've got no test results to judge.


Should you still have questions on choice between Ryzen AI 9 HX 375 and VIA C3-M C3-M-1200, ask them in Comments section, and we shall answer.

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AMD Ryzen AI 9 HX 375
Ryzen AI 9 HX 375
VIA C3-M C3-M-1200
C3-M C3-M-1200

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Community ratings

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