VIA C3-M C3-M-1200 vs Ryzen AI 9 HX 375
Primary details
Comparing Ryzen AI 9 HX 375 and VIA C3-M C3-M-1200 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 291 | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Laptop | Laptop |
| Series | AMD Strix Point (Zen 5/5c, Ryzen AI 3/5/7/9) | C3-M |
| Power efficiency | 34.31 | no data |
| Architecture codename | Strix Point-HX (Zen 5) (2024) | Nehemiah |
| Release date | 25 July 2024 (less than a year ago) | no data (2024 years ago) |
Detailed specifications
Ryzen AI 9 HX 375 and VIA C3-M C3-M-1200 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 12 (Dodeca-Core) | 1 (Single-Core) |
| Threads | 24 | 1 |
| Base clock speed | 2 GHz | no data |
| Boost clock speed | 5.1 GHz | 1.2 GHz |
| Bus rate | no data | 200 MHz |
| L2 cache | 12 MB | no data |
| L3 cache | 24 MB | no data |
| Chip lithography | 4 nm | 130 nm |
| Maximum core temperature | 100 °C | no data |
| 64 bit support | + | - |
| Windows 11 compatibility | no data | - |
Compatibility
Information on Ryzen AI 9 HX 375 and VIA C3-M C3-M-1200 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Socket | FP8 | no data |
| Power consumption (TDP) | 54 Watt | 18 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Ryzen AI 9 HX 375 and VIA C3-M C3-M-1200. You'll probably need this information if you require some particular technology.
| Instruction set extensions | USB 4, XDNA 2 NPU (55 TOPS), SMT, AES, AVX, AVX2, AVX512, FMA3, MMX (+), SHA, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A | no data |
| AES-NI | + | - |
| AVX | + | - |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Ryzen AI 9 HX 375 and VIA C3-M C3-M-1200. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR5 | no data |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | AMD Radeon 890M ( - 2900 MHz) | no data |
Pros & cons summary
| Physical cores | 12 | 1 |
| Threads | 24 | 1 |
| Chip lithography | 4 nm | 130 nm |
| Power consumption (TDP) | 54 Watt | 18 Watt |
Ryzen AI 9 HX 375 has 1100% more physical cores and 2300% more threads, and a 3150% more advanced lithography process.
VIA C3-M C3-M-1200, on the other hand, has 200% lower power consumption.
We couldn't decide between Ryzen AI 9 HX 375 and VIA C3-M C3-M-1200. We've got no test results to judge.
Should you still have questions on choice between Ryzen AI 9 HX 375 and VIA C3-M C3-M-1200, ask them in Comments section, and we shall answer.
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