Mobile Sempron SI-40 vs Ryzen AI 9 HX 375
Primary details
Comparing Ryzen AI 9 HX 375 and Mobile Sempron SI-40 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 302 | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Laptop | Laptop |
| Series | AMD Strix Point (Zen 5/5c, Ryzen AI 3/5/7/9) | AMD Mobile Sempron |
| Power efficiency | 33.40 | no data |
| Architecture codename | Strix Point-HX (Zen 5) (2024) | Sable (2008−2009) |
| Release date | 25 July 2024 (less than a year ago) | 4 July 2008 (16 years ago) |
Detailed specifications
Ryzen AI 9 HX 375 and Mobile Sempron SI-40 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 12 (Dodeca-Core) | 1 (Single-Core) |
| Threads | 24 | 1 |
| Base clock speed | 2 GHz | no data |
| Boost clock speed | 5.1 GHz | 2 GHz |
| Bus rate | no data | 1800 MHz |
| L2 cache | 12 MB | 512 KB |
| L3 cache | 24 MB | no data |
| Chip lithography | 4 nm | 65 nm |
| Maximum core temperature | 100 °C | 100 °C |
| 64 bit support | + | + |
| Windows 11 compatibility | no data | - |
Compatibility
Information on Ryzen AI 9 HX 375 and Mobile Sempron SI-40 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Socket | FP8 | S1g2 |
| Power consumption (TDP) | 54 Watt | 25 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Ryzen AI 9 HX 375 and Mobile Sempron SI-40. You'll probably need this information if you require some particular technology.
| Instruction set extensions | USB 4, XDNA 2 NPU (55 TOPS), SMT, AES, AVX, AVX2, AVX512, FMA3, MMX (+), SHA, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A | 65 nm, 1.075 - 1.125V |
| AES-NI | + | - |
| AVX | + | - |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Ryzen AI 9 HX 375 and Mobile Sempron SI-40. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR5 | no data |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | AMD Radeon 890M | no data |
Pros & cons summary
| Recency | 25 July 2024 | 4 July 2008 |
| Physical cores | 12 | 1 |
| Threads | 24 | 1 |
| Chip lithography | 4 nm | 65 nm |
| Power consumption (TDP) | 54 Watt | 25 Watt |
Ryzen AI 9 HX 375 has an age advantage of 16 years, 1100% more physical cores and 2300% more threads, and a 1525% more advanced lithography process.
Mobile Sempron SI-40, on the other hand, has 116% lower power consumption.
We couldn't decide between Ryzen AI 9 HX 375 and Mobile Sempron SI-40. We've got no test results to judge.
Should you still have questions on choice between Ryzen AI 9 HX 375 and Mobile Sempron SI-40, ask them in Comments section, and we shall answer.
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