Celeron B810E vs Ryzen AI 9 HX 375
Primary details
Comparing Ryzen AI 9 HX 375 and Celeron B810E processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 291 | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Laptop | Laptop |
| Series | AMD Strix Point (Zen 5/5c, Ryzen AI 3/5/7/9) | Intel Celeron |
| Power efficiency | 34.47 | no data |
| Architecture codename | Strix Point-HX (Zen 5) (2024) | Sandy Bridge (2011−2013) |
| Release date | 25 July 2024 (less than a year ago) | no data |
| Launch price (MSRP) | no data | $72 |
Detailed specifications
Ryzen AI 9 HX 375 and Celeron B810E basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 12 (Dodeca-Core) | 2 (Dual-core) |
| Threads | 24 | 2 |
| Base clock speed | 2 GHz | no data |
| Boost clock speed | 5.1 GHz | 1.6 GHz |
| Bus type | no data | DMI 2.0 |
| Bus rate | no data | 4 × 5 GT/s |
| Multiplier | no data | 16 |
| L1 cache | no data | 128 KB |
| L2 cache | 12 MB | 512 KB |
| L3 cache | 24 MB | 2 MB |
| Chip lithography | 4 nm | 32 nm |
| Die size | no data | 131 mm2 |
| Maximum core temperature | 100 °C | no data |
| Number of transistors | no data | 504 Million |
| 64 bit support | + | + |
| Windows 11 compatibility | no data | - |
Compatibility
Information on Ryzen AI 9 HX 375 and Celeron B810E compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | no data | 1 (Uniprocessor) |
| Socket | FP8 | no data |
| Power consumption (TDP) | 54 Watt | 35 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Ryzen AI 9 HX 375 and Celeron B810E. You'll probably need this information if you require some particular technology.
| Instruction set extensions | USB 4, XDNA 2 NPU (55 TOPS), SMT, AES, AVX, AVX2, AVX512, FMA3, MMX (+), SHA, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A | no data |
| AES-NI | + | - |
| FMA | - | + |
| AVX | + | - |
| Enhanced SpeedStep (EIST) | no data | + |
Virtualization technologies
Virtual machine speed-up technologies supported by Ryzen AI 9 HX 375 and Celeron B810E are enumerated here.
| VT-x | no data | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Ryzen AI 9 HX 375 and Celeron B810E. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR5 | DDR3-1333 |
| Maximum memory size | no data | 16 GB |
| Max memory channels | no data | 2 |
| Maximum memory bandwidth | no data | 21.335 GB/s |
| ECC memory support | - | + |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card Compare | AMD Radeon 890M ( - 2900 MHz) | Intel HD Graphics (Sandy Bridge) |
Pros & cons summary
| Integrated graphics card | 21.89 | 0.34 |
| Physical cores | 12 | 2 |
| Threads | 24 | 2 |
| Chip lithography | 4 nm | 32 nm |
| Power consumption (TDP) | 54 Watt | 35 Watt |
Ryzen AI 9 HX 375 has 6338.2% faster integrated GPU, 500% more physical cores and 1100% more threads, and a 700% more advanced lithography process.
Celeron B810E, on the other hand, has 54.3% lower power consumption.
We couldn't decide between Ryzen AI 9 HX 375 and Celeron B810E. We've got no test results to judge.
Should you still have questions on choice between Ryzen AI 9 HX 375 and Celeron B810E, ask them in Comments section, and we shall answer.
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