i7-13700 vs Ryzen AI 9 HX 370
Aggregate performance score
Core i7-13700 outperforms Ryzen AI 9 HX 370 by a minimal 4% based on our aggregate benchmark results.
Primary details
Comparing Ryzen AI 9 HX 370 and Core i7-13700 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 237 | 224 |
| Place by popularity | not in top-100 | not in top-100 |
| Cost-effectiveness evaluation | no data | 49.43 |
| Market segment | Laptop | Desktop processor |
| Power efficiency | 75.34 | 33.76 |
| Architecture codename | Strix Point (2024) | Raptor Lake-S (2023−2024) |
| Release date | July 2024 (recently) | 4 January 2023 (1 year ago) |
| Launch price (MSRP) | no data | $384 |
Cost-effectiveness evaluation
Performance per price, higher is better.
Detailed specifications
Ryzen AI 9 HX 370 and Core i7-13700 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 12 (Dodeca-Core) | 16 (Hexadeca-Core) |
| Threads | 24 | 24 |
| Base clock speed | 2 GHz | 2.1 GHz |
| Boost clock speed | 5.1 GHz | 5.2 GHz |
| Bus rate | 54 MHz | no data |
| L1 cache | 80 KB (per core) | 80K (per core) |
| L2 cache | 1 MB (per core) | 2 MB (per core) |
| L3 cache | 24 MB (shared) | 30 MB (shared) |
| Chip lithography | 4 nm | Intel 7 nm |
| Die size | no data | 257 mm2 |
| Maximum core temperature | 100 °C | 100 °C |
| Maximum case temperature (TCase) | no data | 72 °C |
| 64 bit support | + | + |
| Windows 11 compatibility | no data | + |
Compatibility
Information on Ryzen AI 9 HX 370 and Core i7-13700 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | 1 |
| Socket | FP8 | FCLGA1700 |
| Power consumption (TDP) | 28 Watt | 65 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Ryzen AI 9 HX 370 and Core i7-13700. You'll probably need this information if you require some particular technology.
| Instruction set extensions | USB 4, XDNA 2 NPU (50 TOPS), SMT, AES, AVX, AVX2, AVX512, FMA3, MMX (+), SHA, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
| AES-NI | + | + |
| AVX | + | + |
| Enhanced SpeedStep (EIST) | no data | + |
| Speed Shift | no data | + |
| Turbo Boost Technology | no data | 2.0 |
| Hyper-Threading Technology | no data | + |
| TSX | - | + |
| Idle States | no data | + |
| Thermal Monitoring | - | + |
| SIPP | - | + |
| Turbo Boost Max 3.0 | no data | + |
| Precision Boost 2 | + | no data |
| Deep Learning Boost | - | + |
Security technologies
Ryzen AI 9 HX 370 and Core i7-13700 technologies aimed at improving security, for example, by protecting against hacks.
| TXT | no data | + |
| EDB | no data | + |
| Secure Key | no data | + |
| OS Guard | no data | + |
Virtualization technologies
Virtual machine speed-up technologies supported by Ryzen AI 9 HX 370 and Core i7-13700 are enumerated here.
| AMD-V | + | - |
| VT-d | no data | + |
| VT-x | no data | + |
| EPT | no data | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Ryzen AI 9 HX 370 and Core i7-13700. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR5 | DDR5-5600, DDR4-3200 |
| Maximum memory size | no data | 192 GB |
| Max memory channels | no data | 2 |
| Maximum memory bandwidth | no data | 89.6 GB/s |
| ECC memory support | - | + |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card Compare | AMD Radeon 890M | Intel UHD Graphics 770 |
| Quick Sync Video | - | + |
| Clear Video HD | no data | + |
| Graphics max frequency | no data | 1.6 GHz |
| Execution Units | no data | 32 |
Graphics interfaces
Available interfaces and connections of Ryzen AI 9 HX 370 and Core i7-13700 integrated GPUs.
| Number of displays supported | no data | 4 |
Graphics image quality
Maximum display resolutions supported by Ryzen AI 9 HX 370 and Core i7-13700 integrated GPUs, including resolutions over different interfaces.
| Max resolution over HDMI 1.4 | no data | 4096 x 2160 @ 60Hz |
| Max resolution over eDP | no data | 5120 x 3200 @ 120Hz |
| Max resolution over DisplayPort | no data | 7680 x 4320 @ 60Hz |
Graphics API support
APIs supported by Ryzen AI 9 HX 370 and Core i7-13700 integrated GPUs, sometimes API versions are included.
| DirectX | no data | 12 |
| OpenGL | no data | 4.5 |
Peripherals
Specifications and connection of peripherals supported by Ryzen AI 9 HX 370 and Core i7-13700.
| PCIe version | 4.0 | 5.0 and 4.0 |
| PCI Express lanes | 16 | 16 |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Combined synthetic benchmark score
This is our combined benchmark performance rating. We are regularly improving our combining algorithms, but if you find some perceived inconsistencies, feel free to speak up in comments section, we usually fix problems quickly.
Passmark
Passmark CPU Mark is a widespread benchmark, consisting of 8 different types of workload, including integer and floating point math, extended instructions, compression, encryption and physics calculation. There is also one separate single-threaded scenario measuring single-core performance.
3DMark06 CPU
3DMark06 is a discontinued DirectX 9 benchmark suite from Futuremark. Its CPU part contains two scenarios, one dedicated to artificial intelligence pathfinding, another to game physics using PhysX package.
Cinebench 15 64-bit multi-core
Cinebench Release 15 Multi Core is a variant of Cinebench R15 which uses all the processor threads.
Cinebench 15 64-bit single-core
Cinebench R15 (standing for Release 15) is a benchmark made by Maxon, authors of Cinema 4D. It was superseded by later versions of Cinebench, which use more modern variants of Cinema 4D engine. The Single Core version (sometimes called Single-Thread) only uses a single processor thread to render a room full of reflective spheres and light sources.
Geekbench 5.5 Multi-Core
Blender(-)
Geekbench 5.5 Single-Core
7-Zip Single
7-Zip
WebXPRT 3
CrossMark Overall
WebXPRT 4 Overall
Blender v3.3 Classroom CPU(-)
Geekbench 6.3 Multi-Core
Geekbench 6.3 Single-Core
Pros & cons summary
| Performance score | 22.29 | 23.19 |
| Integrated graphics card | 21.88 | 6.16 |
| Physical cores | 12 | 16 |
| Power consumption (TDP) | 28 Watt | 65 Watt |
Ryzen AI 9 HX 370 has 255.2% faster integrated GPU, and 132.1% lower power consumption.
i7-13700, on the other hand, has a 4% higher aggregate performance score, and 33.3% more physical cores.
Given the minimal performance differences, no clear winner can be declared between Ryzen AI 9 HX 370 and Core i7-13700.
Be aware that Ryzen AI 9 HX 370 is a notebook processor while Core i7-13700 is a desktop one.
Should you still have questions on choice between Ryzen AI 9 HX 370 and Core i7-13700, ask them in Comments section, and we shall answer.
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