i7-870 vs Ryzen 3 PRO 3200G
Aggregate performance score
Ryzen 3 PRO 3200G outperforms Core i7-870 by a whopping 123% based on our aggregate benchmark results.
Primary details
Comparing Ryzen 3 PRO 3200G and Core i7-870 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 1339 | 1930 |
| Place by popularity | not in top-100 | not in top-100 |
| Cost-effectiveness evaluation | no data | 0.23 |
| Market segment | Desktop processor | Desktop processor |
| Series | AMD Ryzen 3 | no data |
| Power efficiency | 6.39 | 1.96 |
| Architecture codename | Zen+ (2018−2019) | Lynnfield (2009−2010) |
| Release date | 30 September 2019 (5 years ago) | 8 September 2009 (15 years ago) |
| Launch price (MSRP) | no data | $305 |
Cost-effectiveness evaluation
Performance per price, higher is better.
Detailed specifications
Ryzen 3 PRO 3200G and Core i7-870 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 4 (Quad-Core) | 4 (Quad-Core) |
| Threads | 4 | 8 |
| Base clock speed | 3.6 GHz | 2.93 GHz |
| Boost clock speed | 4 GHz | 3.6 GHz |
| Bus type | PCIe 3.0 | no data |
| Bus rate | no data | 2.5 GT/s |
| Multiplier | 36 | no data |
| L1 cache | 384 KB | 64 KB (per core) |
| L2 cache | 2 MB | 256 KB (per core) |
| L3 cache | 4 MB | 8 MB (shared) |
| Chip lithography | 12 nm | 45 nm |
| Die size | 209.78 mm2 | 296 mm2 |
| Maximum core temperature | no data | 73 °C |
| Number of transistors | 4940 Million | 774 million |
| 64 bit support | + | + |
| Windows 11 compatibility | + | - |
Compatibility
Information on Ryzen 3 PRO 3200G and Core i7-870 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 (Uniprocessor) | 1 |
| Socket | Socket AM4 | FCLGA1156,LGA1156 |
| Power consumption (TDP) | 65 Watt | 95 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Ryzen 3 PRO 3200G and Core i7-870. You'll probably need this information if you require some particular technology.
| Instruction set extensions | no data | Intel® SSE4.2 |
| AES-NI | + | - |
| AVX | + | - |
| Enhanced SpeedStep (EIST) | no data | + |
| Turbo Boost Technology | no data | 1.0 |
| Hyper-Threading Technology | no data | + |
| Idle States | no data | + |
| Demand Based Switching | no data | - |
| PAE | no data | 36 Bit |
Security technologies
Ryzen 3 PRO 3200G and Core i7-870 technologies aimed at improving security, for example, by protecting against hacks.
| TXT | no data | + |
| EDB | no data | + |
Virtualization technologies
Virtual machine speed-up technologies supported by Ryzen 3 PRO 3200G and Core i7-870 are enumerated here.
| AMD-V | + | - |
| VT-d | no data | + |
| VT-x | no data | + |
| EPT | no data | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Ryzen 3 PRO 3200G and Core i7-870. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR4-2933 | DDR3 |
| Maximum memory size | 64 GB | 16 GB |
| Max memory channels | 2 | 2 |
| Maximum memory bandwidth | 46.933 GB/s | 21 GB/s |
| ECC memory support | + | - |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | AMD Radeon Vega 8 | N/A |
Peripherals
Specifications and connection of peripherals supported by Ryzen 3 PRO 3200G and Core i7-870.
| PCIe version | 3.0 | 2.0 |
| PCI Express lanes | 20 | 16 |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Combined synthetic benchmark score
This is our combined benchmark performance rating. We are regularly improving our combining algorithms, but if you find some perceived inconsistencies, feel free to speak up in comments section, we usually fix problems quickly.
Passmark
Passmark CPU Mark is a widespread benchmark, consisting of 8 different types of workload, including integer and floating point math, extended instructions, compression, encryption and physics calculation. There is also one separate single-threaded scenario measuring single-core performance.
Pros & cons summary
| Performance score | 4.39 | 1.97 |
| Recency | 30 September 2019 | 8 September 2009 |
| Threads | 4 | 8 |
| Chip lithography | 12 nm | 45 nm |
| Power consumption (TDP) | 65 Watt | 95 Watt |
Ryzen 3 PRO 3200G has a 122.8% higher aggregate performance score, an age advantage of 10 years, a 275% more advanced lithography process, and 46.2% lower power consumption.
i7-870, on the other hand, has 100% more threads.
The Ryzen 3 PRO 3200G is our recommended choice as it beats the Core i7-870 in performance tests.
Should you still have questions on choice between Ryzen 3 PRO 3200G and Core i7-870, ask them in Comments section, and we shall answer.
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