Ryzen 3 8300G vs Mobile Sempron X2 NI-52
Primary details
Comparing Mobile Sempron X2 NI-52 and Ryzen 3 8300G processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | not rated | 854 |
| Place by popularity | not in top-100 | not in top-100 |
| Cost-effectiveness evaluation | no data | 32.47 |
| Market segment | Laptop | Desktop processor |
| Series | 2x AMD Mobile Sempron | no data |
| Power efficiency | no data | 13.12 |
| Architecture codename | Sable (2008−2009) | Phoenix2 (2024) |
| Release date | 1 January 2009 (15 years ago) | 8 January 2024 (less than a year ago) |
| Launch price (MSRP) | no data | $176 |
Cost-effectiveness evaluation
Performance per price, higher is better.
Detailed specifications
Mobile Sempron X2 NI-52 and Ryzen 3 8300G basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 2 (Dual-core) | 4 (Quad-Core) |
| Threads | 2 | 8 |
| Base clock speed | no data | 3.4 GHz |
| Boost clock speed | 1.8 GHz | 4.9 GHz |
| Bus rate | 1800 MHz | no data |
| L1 cache | no data | 64 KB (per core) |
| L2 cache | 256 KB | 1 MB (per core) |
| L3 cache | no data | 8 MB (shared) |
| Chip lithography | 65 nm | 4 nm |
| Die size | no data | 137 mm2 |
| Number of transistors | no data | 20,900 million |
| 64 bit support | + | + |
| Windows 11 compatibility | - | no data |
Compatibility
Information on Mobile Sempron X2 NI-52 and Ryzen 3 8300G compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | no data | 1 |
| Socket | no data | AM5 |
| Power consumption (TDP) | 35 Watt | 65 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Mobile Sempron X2 NI-52 and Ryzen 3 8300G. You'll probably need this information if you require some particular technology.
| Instruction set extensions | MMX, 3DNow!, SSE (2,3), AMD64, nxBit, PowerNow | no data |
| AES-NI | - | + |
| AVX | - | + |
| PowerNow | + | - |
| Precision Boost 2 | no data | + |
Virtualization technologies
Virtual machine speed-up technologies supported by Mobile Sempron X2 NI-52 and Ryzen 3 8300G are enumerated here.
| AMD-V | - | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Mobile Sempron X2 NI-52 and Ryzen 3 8300G. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | no data | DDR5 |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | no data | AMD Radeon 740M |
Peripherals
Specifications and connection of peripherals supported by Mobile Sempron X2 NI-52 and Ryzen 3 8300G.
| PCIe version | no data | 4.0 |
| PCI Express lanes | no data | 14 |
Pros & cons summary
| Recency | 1 January 2009 | 8 January 2024 |
| Physical cores | 2 | 4 |
| Threads | 2 | 8 |
| Chip lithography | 65 nm | 4 nm |
| Power consumption (TDP) | 35 Watt | 65 Watt |
Mobile Sempron X2 NI-52 has 85.7% lower power consumption.
Ryzen 3 8300G, on the other hand, has an age advantage of 15 years, 100% more physical cores and 300% more threads, and a 1525% more advanced lithography process.
We couldn't decide between Mobile Sempron X2 NI-52 and Ryzen 3 8300G. We've got no test results to judge.
Be aware that Mobile Sempron X2 NI-52 is a notebook processor while Ryzen 3 8300G is a desktop one.
Should you still have questions on choice between Mobile Sempron X2 NI-52 and Ryzen 3 8300G, ask them in Comments section, and we shall answer.
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