Ryzen Embedded 8845HS vs Mobile Sempron 3300+

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Primary details

Comparing Mobile Sempron 3300+ and Ryzen Embedded 8845HS processor market type (desktop or notebook), architecture, sales start time and price.

Place in the rankingnot ratednot rated
Place by popularitynot in top-100not in top-100
Market segmentLaptopServer
SeriesAMD Mobile Sempronno data
Architecture codenameRoma (2005)Hawk Point (2024)
Release date1 June 2005 (19 years ago)2 April 2024 (less than a year ago)

Detailed specifications

Mobile Sempron 3300+ and Ryzen Embedded 8845HS basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores1 (Single-Core)8 (Octa-Core)
Threads116
Base clock speedno data3.8 GHz
Boost clock speed2 GHz5.1 GHz
Bus rate800 MHzno data
L1 cacheno data64 KB (per core)
L2 cache128 KB1 MB (per core)
L3 cacheno data16 MB (shared)
Chip lithography90 nm4 nm
Die sizeno data178 mm2
Number of transistorsno data25,000 million
64 bit support-+
Windows 11 compatibility-no data

Compatibility

Information on Mobile Sempron 3300+ and Ryzen Embedded 8845HS compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configurationno data1
Socket745FP8
Power consumption (TDP)62/25 Watt45 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Mobile Sempron 3300+ and Ryzen Embedded 8845HS. You'll probably need this information if you require some particular technology.

Instruction set extensionsMMX, SSE, SSE2, SSE3 (Roma Core), Enhanced 3DNow!, NX bitno data
AES-NI-+
AVX-+
Precision Boost 2no data+

Virtualization technologies

Virtual machine speed-up technologies supported by Mobile Sempron 3300+ and Ryzen Embedded 8845HS are enumerated here.

AMD-V-+

Memory specs

Types, maximum amount and channel quantity of RAM supported by Mobile Sempron 3300+ and Ryzen Embedded 8845HS. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory typesno dataDDR5

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics cardno dataAMD Radeon 780M

Peripherals

Specifications and connection of peripherals supported by Mobile Sempron 3300+ and Ryzen Embedded 8845HS.

PCIe versionno data4.0
PCI Express lanesno data20

Pros & cons summary


Recency 1 June 2005 2 April 2024
Physical cores 1 8
Threads 1 16
Chip lithography 90 nm 4 nm
Power consumption (TDP) 62 Watt 45 Watt

Ryzen Embedded 8845HS has an age advantage of 18 years, 700% more physical cores and 1500% more threads, a 2150% more advanced lithography process, and 37.8% lower power consumption.

We couldn't decide between Mobile Sempron 3300+ and Ryzen Embedded 8845HS. We've got no test results to judge.

Be aware that Mobile Sempron 3300+ is a notebook processor while Ryzen Embedded 8845HS is a server/workstation one.


Should you still have questions on choice between Mobile Sempron 3300+ and Ryzen Embedded 8845HS, ask them in Comments section, and we shall answer.

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AMD Mobile Sempron 3300+
Mobile Sempron 3300+
AMD Ryzen Embedded 8845HS
Ryzen Embedded 8845HS

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