Mobile Sempron SI-40 vs E2-9000
Primary details
Comparing E2-9000 and Mobile Sempron SI-40 processor market type (desktop or notebook), architecture, sales start time and price.
Place in the ranking | 2780 | not rated |
Place by popularity | not in top-100 | not in top-100 |
Market segment | Laptop | Laptop |
Series | Bristol Ridge | AMD Mobile Sempron |
Power efficiency | 5.74 | no data |
Architecture codename | Stoney Ridge (2016−2019) | Sable (2008−2009) |
Release date | 1 June 2016 (8 years ago) | 4 July 2008 (16 years ago) |
Detailed specifications
E2-9000 and Mobile Sempron SI-40 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
Physical cores | 2 (Dual-core) | 1 (Single-Core) |
Threads | 2 | 1 |
Base clock speed | 1.8 GHz | no data |
Boost clock speed | 2.2 GHz | 2 GHz |
Bus rate | no data | 1800 MHz |
L2 cache | 1 MB | 512 KB |
Chip lithography | 28 nm | 65 nm |
Die size | 124.5 mm2 | no data |
Maximum core temperature | 90 °C | 100 °C |
Number of transistors | 1200 Million | no data |
64 bit support | + | + |
Windows 11 compatibility | - | - |
Compatibility
Information on E2-9000 and Mobile Sempron SI-40 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
Socket | BGA | S1g2 |
Power consumption (TDP) | 10 Watt | 25 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by E2-9000 and Mobile Sempron SI-40. You'll probably need this information if you require some particular technology.
Instruction set extensions | Virtualization, | 65 nm, 1.075 - 1.125V |
Virtualization technologies
Virtual machine speed-up technologies supported by E2-9000 and Mobile Sempron SI-40 are enumerated here.
AMD-V | + | - |
Memory specs
Types, maximum amount and channel quantity of RAM supported by E2-9000 and Mobile Sempron SI-40. Depending on the motherboard, higher memory frequencies may be supported.
Supported memory types | DDR4 | no data |
Graphics specifications
General parameters of integrated GPUs, if any.
Integrated graphics card | AMD Radeon R2 (Stoney Ridge) | no data |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
3DMark06 CPU
3DMark06 is a discontinued DirectX 9 benchmark suite from Futuremark. Its CPU part contains two scenarios, one dedicated to artificial intelligence pathfinding, another to game physics using PhysX package.
Pros & cons summary
Recency | 1 June 2016 | 4 July 2008 |
Physical cores | 2 | 1 |
Threads | 2 | 1 |
Chip lithography | 28 nm | 65 nm |
Power consumption (TDP) | 10 Watt | 25 Watt |
E2-9000 has an age advantage of 7 years, 100% more physical cores and 100% more threads, a 132.1% more advanced lithography process, and 150% lower power consumption.
We couldn't decide between E2-9000 and Mobile Sempron SI-40. We've got no test results to judge.
Should you still have questions on choice between E2-9000 and Mobile Sempron SI-40, ask them in Comments section, and we shall answer.
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