Ryzen 7 8700F vs i7-2649M

Primary details

Comparing Core i7-2649M and Ryzen 7 8700F processor market type (desktop or notebook), architecture, sales start time and price.

Place in the ranking	not rated	289
Place by popularity	not in top-100	not in top-100
Cost-effectiveness evaluation	no data	52.30
Market segment	Laptop	Desktop processor
Series	Intel Core i7	no data
Power efficiency	no data	28.26
Architecture codename	Sandy Bridge (2011−2013)	Phoenix (2023−2024)
Release date	3 January 2011 (13 years ago)	1 April 2024 (less than a year ago)
Launch price (MSRP)	$346	$270

Cost-effectiveness evaluation

Performance per price, higher is better.

Detailed specifications

Core i7-2649M and Ryzen 7 8700F basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	2 (Dual-core)	8 (Octa-Core)
Threads	4	16
Base clock speed	2.3 GHz	4.1 GHz
Boost clock speed	3.2 GHz	5 GHz
Bus type	DMI 2.0	no data
Bus rate	4 × 5 GT/s	no data
Multiplier	23	no data
L1 cache	128 KB	64 KB (per core)
L2 cache	512 KB	1 MB (per core)
L3 cache	4 MB	16 MB (shared)
Chip lithography	32 nm	4 nm
Die size	149 mm2	178 mm2
Maximum core temperature	100 °C	no data
Number of transistors	624 Million	25,000 million
64 bit support	+	+
Windows 11 compatibility	-	no data
Unlocked multiplier	-	+

Compatibility

Information on Core i7-2649M and Ryzen 7 8700F compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1 (Uniprocessor)	1
Socket	FCBGA1023	AM5
Power consumption (TDP)	25 Watt	65 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Core i7-2649M and Ryzen 7 8700F. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® AVX	no data
AES-NI	+	+
FMA	+	-
AVX	+	+
vPro	+	no data
Enhanced SpeedStep (EIST)	+	no data
My WiFi	+	no data
Turbo Boost Technology	+	no data
Hyper-Threading Technology	+	no data
Idle States	+	no data
Thermal Monitoring	+	-
Flex Memory Access	+	no data
Demand Based Switching	-	no data
FDI	+	no data
Fast Memory Access	+	no data
Precision Boost 2	no data	+

Security technologies

Core i7-2649M and Ryzen 7 8700F technologies aimed at improving security, for example, by protecting against hacks.

TXT	+	no data
EDB	+	no data
Identity Protection	+	-
Anti-Theft	+	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Core i7-2649M and Ryzen 7 8700F are enumerated here.

AMD-V	+	+
VT-d	+	no data
VT-x	+	no data
EPT	+	no data

Memory specs

Types, maximum amount and channel quantity of RAM supported by Core i7-2649M and Ryzen 7 8700F. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR3	DDR5
Maximum memory size	8.01 GB	no data
Max memory channels	2	no data
Maximum memory bandwidth	21.335 GB/s	no data

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card	Intel HD Graphics 3000	N/A
Quick Sync Video	+	-
Clear Video HD	+	no data
Graphics max frequency	1.1 GHz	no data
InTru 3D	+	no data

Graphics interfaces

Available interfaces and connections of Core i7-2649M and Ryzen 7 8700F integrated GPUs.

Number of displays supported	2	no data
eDP	+	no data
DisplayPort	+	-
HDMI	+	-
SDVO	+	no data
CRT	+	no data

Peripherals

Specifications and connection of peripherals supported by Core i7-2649M and Ryzen 7 8700F.

PCIe version	2.0	4.0
PCI Express lanes	16	20

Pros & cons summary

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Recency	3 January 2011	1 April 2024
Physical cores	2	8
Threads	4	16
Chip lithography	32 nm	4 nm
Power consumption (TDP)	25 Watt	65 Watt

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