Ryzen 7 2700X 50th Anniversary vs i3-330M

Primary details

Comparing Core i3-330M and Ryzen 7 2700X 50th Anniversary processor market type (desktop or notebook), architecture, sales start time and price.

Place in the ranking	2750	not rated
Place by popularity	not in top-100	not in top-100
Market segment	Laptop	Desktop processor
Series	Intel Core i3	no data
Power efficiency	1.73	no data
Architecture codename	Arrandale (2010−2011)	Zen (2017−2020)
Release date	7 January 2010 (14 years ago)	29 April 2019 (5 years ago)
Launch price (MSRP)	$49	no data

Detailed specifications

Core i3-330M and Ryzen 7 2700X 50th Anniversary basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	2 (Dual-core)	8 (Octa-Core)
Threads	4	16
Base clock speed	2.13 GHz	3.7 GHz
Boost clock speed	0.03 GHz	4.35 GHz
Bus type	DMI 1.0	no data
Bus rate	1 × 2.5 GT/s	no data
Multiplier	16	no data
L1 cache	128 KB	96K (per core)
L2 cache	512 KB	512K (per core)
L3 cache	3 MB (shared)	16 MB (shared)
Chip lithography	32 nm	12 nm
Die size	81+114 mm2	192 mm2
Maximum core temperature	90 °C for rPGA, 105 °C for BGA	no data
Number of transistors	382 million	4,800 million
64 bit support	+	+
Windows 11 compatibility	-	-
Unlocked multiplier	-	+

Compatibility

Information on Core i3-330M and Ryzen 7 2700X 50th Anniversary compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1 (Uniprocessor)	1
Socket	BGA1288,PGA988	AM4
Power consumption (TDP)	35 Watt	105 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Core i3-330M and Ryzen 7 2700X 50th Anniversary. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2	no data
AES-NI	-	+
FMA	+	-
AVX	-	+
Enhanced SpeedStep (EIST)	+	no data
Turbo Boost Technology	-	no data
Hyper-Threading Technology	+	no data
Idle States	+	no data
Thermal Monitoring	+	-
Flex Memory Access	+	no data
PAE	36 Bit	no data
FDI	+	no data
Fast Memory Access	+	no data
Precision Boost 2	no data	+

Security technologies

Core i3-330M and Ryzen 7 2700X 50th Anniversary technologies aimed at improving security, for example, by protecting against hacks.

TXT	-	no data
EDB	+	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Core i3-330M and Ryzen 7 2700X 50th Anniversary are enumerated here.

AMD-V	-	+
VT-d	-	no data
VT-x	+	no data
EPT	+	no data

Memory specs

Types, maximum amount and channel quantity of RAM supported by Core i3-330M and Ryzen 7 2700X 50th Anniversary. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR3-800, DDR3-1066	DDR4 Dual-channel
Maximum memory size	8 GB	no data
Max memory channels	2	no data
Maximum memory bandwidth	17.051 GB/s	no data

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card	Intel® HD Graphics for Previous Generation Intel® Processors	no data
Clear Video	+	no data
Clear Video HD	+	no data
Graphics max frequency	667 MHz	no data

Graphics interfaces

Available interfaces and connections of Core i3-330M and Ryzen 7 2700X 50th Anniversary integrated GPUs.

Number of displays supported

2

no data

Peripherals

Specifications and connection of peripherals supported by Core i3-330M and Ryzen 7 2700X 50th Anniversary.

PCIe version	2.0	no data
PCI Express lanes	16	no data

Pros & cons summary

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Recency	7 January 2010	29 April 2019
Physical cores	2	8
Threads	4	16
Chip lithography	32 nm	12 nm
Power consumption (TDP)	35 Watt	105 Watt

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