Ryzen AI 9 HX 170 vs i3-2100
Primary details
Comparing Core i3-2100 and Ryzen AI 9 HX 170 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 2358 | not rated |
| Place by popularity | 100 | not in top-100 |
| Cost-effectiveness evaluation | 0.28 | no data |
| Market segment | Desktop processor | Laptop |
| Series | no data | AMD Strix Point (Zen 5/5c, Ryzen AI 3/5/7/9) |
| Power efficiency | 1.70 | no data |
| Architecture codename | Sandy Bridge (2011−2013) | Strix Point-HX (Zen 5) (2024) |
| Release date | 20 February 2011 (13 years ago) | 4 June 2024 (less than a year ago) |
| Launch price (MSRP) | $73 | no data |
Cost-effectiveness evaluation
Performance per price, higher is better.
Detailed specifications
Core i3-2100 and Ryzen AI 9 HX 170 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 2 (Dual-core) | 12 (Dodeca-Core) |
| Threads | 4 | 24 |
| Base clock speed | 3.1 GHz | no data |
| Boost clock speed | 3.1 GHz | 5.1 GHz |
| Bus rate | 5 GT/s | no data |
| L1 cache | 64 KB (per core) | no data |
| L2 cache | 256 KB (per core) | no data |
| L3 cache | 3 MB (shared) | 36 MB |
| Chip lithography | 32 nm | 3 nm |
| Die size | 131 mm2 | no data |
| Maximum core temperature | 69 °C | no data |
| Number of transistors | 504 million | no data |
| 64 bit support | + | + |
| Windows 11 compatibility | - | no data |
Compatibility
Information on Core i3-2100 and Ryzen AI 9 HX 170 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | no data |
| Socket | FCLGA1155 | no data |
| Power consumption (TDP) | 65 Watt | 55 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Core i3-2100 and Ryzen AI 9 HX 170. You'll probably need this information if you require some particular technology.
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX | XDNA 2 NPU |
| Enhanced SpeedStep (EIST) | + | no data |
| Turbo Boost Technology | - | no data |
| Hyper-Threading Technology | + | no data |
| Idle States | + | no data |
| Thermal Monitoring | + | - |
| Flex Memory Access | + | no data |
| FDI | + | no data |
| Fast Memory Access | + | no data |
Security technologies
Core i3-2100 and Ryzen AI 9 HX 170 technologies aimed at improving security, for example, by protecting against hacks.
| TXT | + | no data |
| EDB | + | no data |
| Identity Protection | + | - |
Virtualization technologies
Virtual machine speed-up technologies supported by Core i3-2100 and Ryzen AI 9 HX 170 are enumerated here.
| VT-d | - | no data |
| VT-x | + | no data |
| EPT | + | no data |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Core i3-2100 and Ryzen AI 9 HX 170. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR3 | no data |
| Maximum memory size | 32 GB | no data |
| Max memory channels | 2 | no data |
| Maximum memory bandwidth | 21 GB/s | no data |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | Intel HD Graphics 2000 | no data |
| Quick Sync Video | + | - |
| Clear Video HD | + | no data |
| Graphics max frequency | 1.1 GHz | no data |
| InTru 3D | + | no data |
Graphics interfaces
Available interfaces and connections of Core i3-2100 and Ryzen AI 9 HX 170 integrated GPUs.
| Number of displays supported | 2 | no data |
Peripherals
Specifications and connection of peripherals supported by Core i3-2100 and Ryzen AI 9 HX 170.
| PCIe version | 2.0 | no data |
| PCI Express lanes | 16 | no data |
Pros & cons summary
| Recency | 20 February 2011 | 4 June 2024 |
| Physical cores | 2 | 12 |
| Threads | 4 | 24 |
| Chip lithography | 32 nm | 3 nm |
| Power consumption (TDP) | 65 Watt | 55 Watt |
Ryzen AI 9 HX 170 has an age advantage of 13 years, 500% more physical cores and 500% more threads, a 966.7% more advanced lithography process, and 18.2% lower power consumption.
We couldn't decide between Core i3-2100 and Ryzen AI 9 HX 170. We've got no test results to judge.
Note that Core i3-2100 is a desktop processor while Ryzen AI 9 HX 170 is a notebook one.
Should you still have questions on choice between Core i3-2100 and Ryzen AI 9 HX 170, ask them in Comments section, and we shall answer.
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