Core i3-2367M vs Core 2 Duo T7200

Primary details

Comparing Core 2 Duo T7200 and Core i3-2367M processor market type (desktop or notebook), architecture, sales start time and price.

Place in the ranking	not rated	2838
Place by popularity	not in top-100	not in top-100
Market segment	Laptop	Laptop
Series	Intel Core 2 Duo	Intel Core i3
Power efficiency	no data	2.95
Architecture codename	Merom (2006−2008)	Sandy Bridge (2011−2013)
Release date	28 July 2006 (18 years ago)	1 October 2011 (13 years ago)
Launch price (MSRP)	$286	$250

Detailed specifications

Core 2 Duo T7200 and Core i3-2367M basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	2 (Dual-core)	2 (Dual-core)
Threads	2	4
Base clock speed	2 GHz	1.4 GHz
Boost clock speed	2 GHz	1.4 GHz
Bus type	no data	DMI 2.0
Bus rate	667 MHz	4 × 5 GT/s
Multiplier	no data	14
L1 cache	64 KB	128 KB
L2 cache	4 MB	512 KB
L3 cache	0 KB	3 MB (shared)
Chip lithography	65 nm	32 nm
Die size	143 mm2	149 mm2
Maximum core temperature	100 °C	100 °C
Number of transistors	291 Million	624 million
64 bit support	+	+
Windows 11 compatibility	-	-
VID voltage range	1.0375V-1.3V	no data

Compatibility

Information on Core 2 Duo T7200 and Core i3-2367M compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1	1 (Uniprocessor)
Socket	PPGA478, PBGA479	FCBGA1023
Power consumption (TDP)	34 Watt	17 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Core 2 Duo T7200 and Core i3-2367M. You'll probably need this information if you require some particular technology.

Instruction set extensions	no data	Intel® AVX
FMA	-	+
AVX	-	+
Enhanced SpeedStep (EIST)	+	+
My WiFi	no data	+
Turbo Boost Technology	-	-
Hyper-Threading Technology	-	+
Idle States	-	+
Thermal Monitoring	-	+
Flex Memory Access	no data	+
Demand Based Switching	-	-
FDI	no data	+
Fast Memory Access	no data	+
FSB parity	-	no data

Security technologies

Core 2 Duo T7200 and Core i3-2367M technologies aimed at improving security, for example, by protecting against hacks.

TXT	-	-
EDB	+	+
Identity Protection	-	+
Anti-Theft	no data	+

Virtualization technologies

Virtual machine speed-up technologies supported by Core 2 Duo T7200 and Core i3-2367M are enumerated here.

AMD-V	-	+
VT-d	no data	-
VT-x	+	+
EPT	no data	+

Memory specs

Types, maximum amount and channel quantity of RAM supported by Core 2 Duo T7200 and Core i3-2367M. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	no data	DDR3
Maximum memory size	no data	16 GB
Max memory channels	no data	2
Maximum memory bandwidth	no data	21.335 GB/s

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card	no data	Intel HD Graphics 3000
Quick Sync Video	-	+
Clear Video HD	no data	+
Graphics max frequency	no data	1 GHz
InTru 3D	no data	+

Graphics interfaces

Available interfaces and connections of Core 2 Duo T7200 and Core i3-2367M integrated GPUs.

Number of displays supported	no data	2
eDP	no data	+
DisplayPort	-	+
HDMI	-	+
SDVO	no data	+
CRT	no data	+

Peripherals

Specifications and connection of peripherals supported by Core 2 Duo T7200 and Core i3-2367M.

PCIe version	no data	2.0
PCI Express lanes	no data	16

Synthetic benchmark performance

Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.

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Pros & cons summary

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Recency	28 July 2006	1 October 2011
Threads	2	4
Chip lithography	65 nm	32 nm
Power consumption (TDP)	34 Watt	17 Watt

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