VIA C7-M C7-M-1000 vs Core 2 Duo T5550
Primary details
Comparing Core 2 Duo T5550 and VIA C7-M C7-M-1000 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 3002 | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Laptop | Laptop |
| Series | Intel Core 2 Duo | C7-M |
| Power efficiency | 1.11 | no data |
| Architecture codename | Merom (2006−2008) | Esther |
| Release date | 1 January 2008 (16 years ago) | no data |
Detailed specifications
Core 2 Duo T5550 and VIA C7-M C7-M-1000 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 2 (Dual-core) | 1 (Single-Core) |
| Threads | 2 | 1 |
| Base clock speed | 1.83 GHz | no data |
| Boost clock speed | 1.83 GHz | 1 GHz |
| Bus rate | 667 MHz | 400 MHz |
| L2 cache | 2 MB | no data |
| L3 cache | 2 MB L2 Cache | no data |
| Chip lithography | 65 nm | 90 nm |
| Die size | 143 mm2 | no data |
| Maximum core temperature | 100 °C | no data |
| Number of transistors | 291 Million | no data |
| 64 bit support | + | - |
| Windows 11 compatibility | - | - |
| VID voltage range | 1.075V-1.25V | no data |
Compatibility
Information on Core 2 Duo T5550 and VIA C7-M C7-M-1000 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Socket | PPGA478 | no data |
| Power consumption (TDP) | 35 Watt | 3.5 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Core 2 Duo T5550 and VIA C7-M C7-M-1000. You'll probably need this information if you require some particular technology.
| Enhanced SpeedStep (EIST) | + | no data |
| Turbo Boost Technology | - | no data |
| Hyper-Threading Technology | - | no data |
| Demand Based Switching | - | no data |
| FSB parity | - | no data |
Security technologies
Core 2 Duo T5550 and VIA C7-M C7-M-1000 technologies aimed at improving security, for example, by protecting against hacks.
| TXT | - | no data |
| EDB | + | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by Core 2 Duo T5550 and VIA C7-M C7-M-1000 are enumerated here.
| VT-x | - | no data |
Pros & cons summary
| Physical cores | 2 | 1 |
| Threads | 2 | 1 |
| Chip lithography | 65 nm | 90 nm |
| Power consumption (TDP) | 35 Watt | 3 Watt |
Core 2 Duo T5550 has 100% more physical cores and 100% more threads, and a 38.5% more advanced lithography process.
VIA C7-M C7-M-1000, on the other hand, has 1066.7% lower power consumption.
We couldn't decide between Core 2 Duo T5550 and VIA C7-M C7-M-1000. We've got no test results to judge.
Should you still have questions on choice between Core 2 Duo T5550 and VIA C7-M C7-M-1000, ask them in Comments section, and we shall answer.
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