Core i3-9100F vs Core 2 Duo T5550
Primary details
Comparing Core 2 Duo T5550 and Core i3-9100F processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | not rated | 1370 |
| Place by popularity | not in top-100 | 40 |
| Cost-effectiveness evaluation | no data | 9.90 |
| Market segment | Laptop | Desktop processor |
| Series | Intel Core 2 Duo | Intel Core i3 |
| Power efficiency | no data | 6.17 |
| Architecture codename | Merom (2006−2008) | Coffee Lake-R (2018−2019) |
| Release date | 1 January 2008 (16 years ago) | 23 April 2019 (5 years ago) |
| Launch price (MSRP) | no data | $122 |
Cost-effectiveness evaluation
Performance per price, higher is better.
Detailed specifications
Core 2 Duo T5550 and Core i3-9100F basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 2 (Dual-core) | 4 (Quad-Core) |
| Threads | 2 | 4 |
| Base clock speed | 1.83 GHz | 3.6 GHz |
| Boost clock speed | 1.83 GHz | 4.2 GHz |
| Bus type | no data | DMI 3.0 |
| Bus rate | 667 MHz | 4 × 8 GT/s |
| Multiplier | no data | 36 |
| L1 cache | no data | 256 KB |
| L2 cache | 2 MB | 1 MB |
| L3 cache | 2 MB L2 Cache | 6 MB (shared) |
| Chip lithography | 65 nm | 14 nm |
| Die size | 143 mm2 | 126 mm2 |
| Maximum core temperature | 100 °C | 100 °C |
| Maximum case temperature (TCase) | no data | 72 °C |
| Number of transistors | 291 Million | no data |
| 64 bit support | + | + |
| Windows 11 compatibility | - | + |
| VID voltage range | 1.075V-1.25V | no data |
Compatibility
Information on Core 2 Duo T5550 and Core i3-9100F compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | no data | 1 (Uniprocessor) |
| Socket | PPGA478 | FCLGA1151 |
| Power consumption (TDP) | 35 Watt | 65 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Core 2 Duo T5550 and Core i3-9100F. You'll probably need this information if you require some particular technology.
| Instruction set extensions | no data | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
| AES-NI | - | + |
| AVX | - | + |
| Enhanced SpeedStep (EIST) | + | + |
| Turbo Boost Technology | - | 2.0 |
| Hyper-Threading Technology | - | - |
| Idle States | no data | + |
| Thermal Monitoring | - | + |
| Demand Based Switching | - | no data |
| FSB parity | - | no data |
Security technologies
Core 2 Duo T5550 and Core i3-9100F technologies aimed at improving security, for example, by protecting against hacks.
| TXT | - | - |
| EDB | + | + |
| Secure Key | no data | + |
| MPX | - | + |
| Identity Protection | - | + |
| SGX | no data | Yes with Intel® ME |
| OS Guard | no data | + |
Virtualization technologies
Virtual machine speed-up technologies supported by Core 2 Duo T5550 and Core i3-9100F are enumerated here.
| AMD-V | - | + |
| VT-d | no data | + |
| VT-x | - | + |
| EPT | no data | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Core 2 Duo T5550 and Core i3-9100F. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | no data | DDR4 |
| Maximum memory size | no data | 64 GB |
| Max memory channels | no data | 2 |
| Maximum memory bandwidth | no data | 38.397 GB/s |
| ECC memory support | - | + |
Peripherals
Specifications and connection of peripherals supported by Core 2 Duo T5550 and Core i3-9100F.
| PCIe version | no data | 3.0 |
| PCI Express lanes | no data | 16 |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Passmark
Passmark CPU Mark is a widespread benchmark, consisting of 8 different types of workload, including integer and floating point math, extended instructions, compression, encryption and physics calculation. There is also one separate single-threaded scenario measuring single-core performance.
GeekBench 5 Single-Core
GeekBench 5 Single-Core is a cross-platform application developed in the form of CPU tests that independently recreate certain real-world tasks with which to accurately measure performance. This version uses only a single CPU core.
GeekBench 5 Multi-Core
GeekBench 5 Multi-Core is a cross-platform application developed in the form of CPU tests that independently recreate certain real-world tasks with which to accurately measure performance. This version uses all available CPU cores.
Cinebench 10 32-bit single-core
Cinebench R10 is an ancient ray tracing benchmark for processors by Maxon, authors of Cinema 4D. Its single core version uses just one CPU thread to render a futuristic looking motorcycle.
Cinebench 10 32-bit multi-core
Cinebench Release 10 Multi Core is a variant of Cinebench R10 using all the processor threads. Possible number of threads is limited by 16 in this version.
Pros & cons summary
| Recency | 1 January 2008 | 23 April 2019 |
| Physical cores | 2 | 4 |
| Threads | 2 | 4 |
| Chip lithography | 65 nm | 14 nm |
| Power consumption (TDP) | 35 Watt | 65 Watt |
Core 2 Duo T5550 has 85.7% lower power consumption.
i3-9100F, on the other hand, has an age advantage of 11 years, 100% more physical cores and 100% more threads, and a 364.3% more advanced lithography process.
We couldn't decide between Core 2 Duo T5550 and Core i3-9100F. We've got no test results to judge.
Be aware that Core 2 Duo T5550 is a notebook processor while Core i3-9100F is a desktop one.
Should you still have questions on choice between Core 2 Duo T5550 and Core i3-9100F, ask them in Comments section, and we shall answer.
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