Core i3-2355M vs Core 2 Duo T5550
Primary details
Comparing Core 2 Duo T5550 and Core i3-2355M processor market type (desktop or notebook), architecture, sales start time and price.
Place in the ranking | 3001 | not rated |
Place by popularity | not in top-100 | not in top-100 |
Market segment | Laptop | Laptop |
Series | Intel Core 2 Duo | Intel Core i3 |
Power efficiency | 1.11 | no data |
Architecture codename | Merom (2006−2008) | Sandy Bridge (2011−2013) |
Release date | 1 January 2008 (16 years ago) | no data |
Detailed specifications
Core 2 Duo T5550 and Core i3-2355M basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
Physical cores | 2 (Dual-core) | 2 (Dual-core) |
Threads | 2 | 4 |
Base clock speed | 1.83 GHz | no data |
Boost clock speed | 1.83 GHz | 1.3 GHz |
Bus type | no data | DMI 2.0 |
Bus rate | 667 MHz | 4 × 5 GT/s |
Multiplier | no data | 13 |
L1 cache | no data | 128 KB |
L2 cache | 2 MB | 512 KB |
L3 cache | 2 MB L2 Cache | 3 MB |
Chip lithography | 65 nm | 32 nm |
Die size | 143 mm2 | 149 mm2 |
Maximum core temperature | 100 °C | no data |
Number of transistors | 291 Million | 624 Million |
64 bit support | + | + |
Windows 11 compatibility | - | - |
VID voltage range | 1.075V-1.25V | no data |
Compatibility
Information on Core 2 Duo T5550 and Core i3-2355M compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
Number of CPUs in a configuration | no data | 1 (Uniprocessor) |
Socket | PPGA478 | no data |
Power consumption (TDP) | 35 Watt | 17 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Core 2 Duo T5550 and Core i3-2355M. You'll probably need this information if you require some particular technology.
FMA | - | + |
AVX | - | + |
Enhanced SpeedStep (EIST) | + | + |
Turbo Boost Technology | - | no data |
Hyper-Threading Technology | - | no data |
Demand Based Switching | - | no data |
FSB parity | - | no data |
Security technologies
Core 2 Duo T5550 and Core i3-2355M technologies aimed at improving security, for example, by protecting against hacks.
TXT | - | no data |
EDB | + | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by Core 2 Duo T5550 and Core i3-2355M are enumerated here.
VT-x | - | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Core 2 Duo T5550 and Core i3-2355M. Depending on the motherboard, higher memory frequencies may be supported.
Supported memory types | no data | DDR3-1333 |
Maximum memory size | no data | 16 GB |
Max memory channels | no data | 2 |
Maximum memory bandwidth | no data | 21.335 GB/s |
Graphics specifications
General parameters of integrated GPUs, if any.
Integrated graphics card | no data | Intel HD Graphics 3000 |
Pros & cons summary
Threads | 2 | 4 |
Chip lithography | 65 nm | 32 nm |
Power consumption (TDP) | 35 Watt | 17 Watt |
i3-2355M has 100% more threads, a 103.1% more advanced lithography process, and 105.9% lower power consumption.
We couldn't decide between Core 2 Duo T5550 and Core i3-2355M. We've got no test results to judge.
Should you still have questions on choice between Core 2 Duo T5550 and Core i3-2355M, ask them in Comments section, and we shall answer.
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