Core i3-9000 vs Core 2 Duo E8400

Primary details

Comparing Core 2 Duo E8400 and Core i3-9000 processor market type (desktop or notebook), architecture, sales start time and price.

Place in the ranking	2667	not rated
Place by popularity	not in top-100	not in top-100
Market segment	Desktop processor	Desktop processor
Series	no data	Intel Core i3
Power efficiency	1.07	no data
Architecture codename	Wolfdale (2008−2010)	Coffee Lake (2017−2019)
Release date	1 January 2008 (16 years ago)	1 September 2018 (6 years ago)

Detailed specifications

Core 2 Duo E8400 and Core i3-9000 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	2 (Dual-core)	4 (Quad-Core)
Threads	2	4
Base clock speed	3 GHz	3.7 GHz
Boost clock speed	3 GHz	3.7 GHz
Bus type	no data	DMI 3.0
Bus rate	1333 MHz	4 × 8 GT/s
Multiplier	no data	37
L1 cache	64 KB (per core)	64K (per core)
L2 cache	6 MB (shared)	256K (per core)
L3 cache	0 KB	6 MB (shared)
Chip lithography	45 nm	14 nm
Die size	104 mm2	126 mm2
Maximum case temperature (TCase)	72 °C	72 °C
Number of transistors	410 million	no data
64 bit support	+	+
Windows 11 compatibility	-	-
VID voltage range	0.85V-1.3625V	no data

Compatibility

Information on Core 2 Duo E8400 and Core i3-9000 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1	1 (Uniprocessor)
Socket	LGA775	1151
Power consumption (TDP)	65 Watt	65 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Core 2 Duo E8400 and Core i3-9000. You'll probably need this information if you require some particular technology.

AES-NI	-	+
AVX	-	+
Enhanced SpeedStep (EIST)	+	+
Turbo Boost Technology	-	no data
Hyper-Threading Technology	-	no data
Idle States	+	no data
Thermal Monitoring	+	-
Demand Based Switching	-	no data
FSB parity	-	no data

Security technologies

Core 2 Duo E8400 and Core i3-9000 technologies aimed at improving security, for example, by protecting against hacks.

TXT	+	no data
EDB	+	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Core 2 Duo E8400 and Core i3-9000 are enumerated here.

VT-d	+	+
VT-x	+	+

Memory specs

Types, maximum amount and channel quantity of RAM supported by Core 2 Duo E8400 and Core i3-9000. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR1, DDR2, DDR3	DDR4 Dual-channel
Maximum memory size	no data	64 GB
Max memory channels	no data	2
Maximum memory bandwidth	no data	38.397 GB/s
ECC memory support	-	+

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card

On certain motherboards (Chipset feature)

Intel UHD Graphics 630

Peripherals

Specifications and connection of peripherals supported by Core 2 Duo E8400 and Core i3-9000.

PCIe version

2.0

3.0

Pros & cons summary

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Recency	1 January 2008	1 September 2018
Physical cores	2	4
Threads	2	4
Chip lithography	45 nm	14 nm

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