EPYC Embedded 8534P vs Celeron 3765U

Primary details

Comparing Celeron 3765U and EPYC Embedded 8534P processor market type (desktop or notebook), architecture, sales start time and price.

Place in the ranking	2615	not rated
Place by popularity	not in top-100	not in top-100
Market segment	Laptop	Server
Series	Intel Celeron	no data
Power efficiency	4.98	no data
Architecture codename	Broadwell (2015−2019)	Siena (2023−2024)
Release date	1 June 2015 (9 years ago)	1 October 2024 (less than a year ago)
Launch price (MSRP)	$107	no data

Detailed specifications

Celeron 3765U and EPYC Embedded 8534P basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	2 (Dual-core)	64 (Tetrahexaconta-Core)
Threads	2	128
Base clock speed	1.9 GHz	2.3 GHz
Boost clock speed	1.9 GHz	3.1 GHz
Bus rate	5 GT/s	no data
L1 cache	128 KB	64 KB (per core)
L2 cache	512 KB	1 MB (per core)
L3 cache	2 MB	128 MB (shared)
Chip lithography	14 nm	5 nm
Die size	82 mm2	4x 73 mm2
Maximum core temperature	105 °C	no data
Maximum case temperature (TCase)	no data	75 °C
Number of transistors	1300 Million	35,500 million
64 bit support	+	+
Windows 11 compatibility	-	no data

Compatibility

Information on Celeron 3765U and EPYC Embedded 8534P compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1	1
Socket	FCBGA1168	SP6
Power consumption (TDP)	15 Watt	200 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Celeron 3765U and EPYC Embedded 8534P. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2	no data
AES-NI	+	+
AVX	+	+
Enhanced SpeedStep (EIST)	+	no data
Turbo Boost Technology	-	no data
Hyper-Threading Technology	-	no data
Thermal Monitoring	+	-
Flex Memory Access	+	no data
Smart Response	-	no data
FDI	+	no data
Fast Memory Access	+	no data
Precision Boost 2	no data	+

Security technologies

Celeron 3765U and EPYC Embedded 8534P technologies aimed at improving security, for example, by protecting against hacks.

TXT	-	no data
EDB	+	no data
Secure Key	+	no data
Identity Protection	+	-
OS Guard	-	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Celeron 3765U and EPYC Embedded 8534P are enumerated here.

AMD-V	+	+
VT-d	+	no data
VT-x	+	no data
EPT	+	no data

Memory specs

Types, maximum amount and channel quantity of RAM supported by Celeron 3765U and EPYC Embedded 8534P. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR3	DDR5
Maximum memory size	16 GB	no data
Max memory channels	2	no data
Maximum memory bandwidth	25.6 GB/s	no data

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card	Intel® HD Graphics for 5th Generation Intel® Processors	N/A
Quick Sync Video	+	-
Clear Video	+	no data
Graphics max frequency	850 MHz	no data
InTru 3D	+	no data

Graphics interfaces

Available interfaces and connections of Celeron 3765U and EPYC Embedded 8534P integrated GPUs.

Number of displays supported	3	no data
eDP	+	no data
DisplayPort	+	-
HDMI	+	-

Graphics API support

APIs supported by Celeron 3765U and EPYC Embedded 8534P integrated GPUs, sometimes API versions are included.

DirectX

11.2/12

no data

Peripherals

Specifications and connection of peripherals supported by Celeron 3765U and EPYC Embedded 8534P.

PCIe version	2.0	5.0
PCI Express lanes	12	96

Pros & cons summary

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Recency	1 June 2015	1 October 2024
Physical cores	2	64
Threads	2	128
Chip lithography	14 nm	5 nm
Power consumption (TDP)	15 Watt	200 Watt

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