Celeron N3050 vs Ryzen AI 9 HX 370
Primary details
Comparing Ryzen AI 9 HX 370 and Celeron N3050 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 232 | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Laptop | Laptop |
| Series | no data | Intel Celeron |
| Power efficiency | 75.43 | no data |
| Architecture codename | Strix Point (2024) | Braswell (2015−2016) |
| Release date | July 2024 (recently) | 1 April 2015 (9 years ago) |
| Launch price (MSRP) | no data | $107 |
Detailed specifications
Ryzen AI 9 HX 370 and Celeron N3050 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 12 (Dodeca-Core) | 2 (Dual-core) |
| Threads | 24 | 2 |
| Base clock speed | 2 GHz | 1.6 GHz |
| Boost clock speed | 5.1 GHz | 2.16 GHz |
| Bus type | no data | IDI |
| Bus rate | 54 MHz | no data |
| L1 cache | 80 KB (per core) | no data |
| L2 cache | 1 MB (per core) | 1 MB |
| L3 cache | 24 MB (shared) | 0 KB |
| Chip lithography | 4 nm | 14 nm |
| Maximum core temperature | 100 °C | 90 °C |
| 64 bit support | + | + |
| Windows 11 compatibility | no data | - |
Compatibility
Information on Ryzen AI 9 HX 370 and Celeron N3050 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | 1 (Uniprocessor) |
| Socket | FP8 | FCBGA1170 |
| Power consumption (TDP) | 28 Watt | 6 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Ryzen AI 9 HX 370 and Celeron N3050. You'll probably need this information if you require some particular technology.
| Instruction set extensions | USB 4, XDNA 2 NPU (50 TOPS), SMT, AES, AVX, AVX2, AVX512, FMA3, MMX (+), SHA, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A | no data |
| AES-NI | + | + |
| AVX | + | - |
| Enhanced SpeedStep (EIST) | no data | + |
| Turbo Boost Technology | no data | - |
| Hyper-Threading Technology | no data | - |
| Idle States | no data | + |
| Thermal Monitoring | - | + |
| Smart Response | no data | - |
| GPIO | no data | + |
| Smart Connect | no data | - |
| HD Audio | no data | + |
| RST | no data | - |
| Precision Boost 2 | + | no data |
Security technologies
Ryzen AI 9 HX 370 and Celeron N3050 technologies aimed at improving security, for example, by protecting against hacks.
| TXT | no data | - |
| EDB | no data | + |
| Secure Boot | no data | + |
| Secure Key | no data | + |
| Identity Protection | - | + |
| OS Guard | no data | - |
| Anti-Theft | no data | - |
Virtualization technologies
Virtual machine speed-up technologies supported by Ryzen AI 9 HX 370 and Celeron N3050 are enumerated here.
| AMD-V | + | - |
| VT-d | no data | - |
| VT-x | no data | + |
| VT-i | no data | - |
| EPT | no data | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Ryzen AI 9 HX 370 and Celeron N3050. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR5 | DDR3 |
| Maximum memory size | no data | 8 GB |
| Max memory channels | no data | 2 |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | AMD Radeon 890M | Intel® HD Graphics for Intel® Celeron® Processor N3000 Series |
| Max video memory | no data | 8 GB |
| Quick Sync Video | - | + |
| Clear Video | no data | + |
| Clear Video HD | no data | + |
| Graphics max frequency | no data | 600 MHz |
| Execution Units | no data | 12 |
Graphics interfaces
Available interfaces and connections of Ryzen AI 9 HX 370 and Celeron N3050 integrated GPUs.
| Number of displays supported | no data | 3 |
| eDP | no data | + |
| DisplayPort | - | + |
| HDMI | - | + |
Graphics API support
APIs supported by Ryzen AI 9 HX 370 and Celeron N3050 integrated GPUs, sometimes API versions are included.
| DirectX | no data | + |
| OpenGL | no data | + |
Peripherals
Specifications and connection of peripherals supported by Ryzen AI 9 HX 370 and Celeron N3050.
| PCIe version | 4.0 | 2.0 |
| PCI Express lanes | 16 | 4 |
| USB revision | no data | 2.0/3.0 |
| Total number of SATA ports | no data | 2 |
| Max number of SATA 6 Gb/s Ports | no data | 2 |
| Number of USB ports | no data | 5 |
| Integrated LAN | no data | - |
| UART | no data | + |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Passmark
Passmark CPU Mark is a widespread benchmark, consisting of 8 different types of workload, including integer and floating point math, extended instructions, compression, encryption and physics calculation. There is also one separate single-threaded scenario measuring single-core performance.
3DMark06 CPU
3DMark06 is a discontinued DirectX 9 benchmark suite from Futuremark. Its CPU part contains two scenarios, one dedicated to artificial intelligence pathfinding, another to game physics using PhysX package.
Cinebench 15 64-bit multi-core
Cinebench Release 15 Multi Core is a variant of Cinebench R15 which uses all the processor threads.
Cinebench 15 64-bit single-core
Cinebench R15 (standing for Release 15) is a benchmark made by Maxon, authors of Cinema 4D. It was superseded by later versions of Cinebench, which use more modern variants of Cinema 4D engine. The Single Core version (sometimes called Single-Thread) only uses a single processor thread to render a room full of reflective spheres and light sources.
Pros & cons summary
| Physical cores | 12 | 2 |
| Threads | 24 | 2 |
| Chip lithography | 4 nm | 14 nm |
| Power consumption (TDP) | 28 Watt | 6 Watt |
Ryzen AI 9 HX 370 has 500% more physical cores and 1100% more threads, and a 250% more advanced lithography process.
Celeron N3050, on the other hand, has 366.7% lower power consumption.
We couldn't decide between Ryzen AI 9 HX 370 and Celeron N3050. We've got no test results to judge.
Should you still have questions on choice between Ryzen AI 9 HX 370 and Celeron N3050, ask them in Comments section, and we shall answer.
Similar processor comparisons
We picked several similar comparisons of processors in the same market segment and performance relatively close to those reviewed on this page.
