Celeron 807 vs Mobile Sempron 3300+
Primary details
Comparing Mobile Sempron 3300+ and Celeron 807 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | not rated | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Laptop | Laptop |
| Series | AMD Mobile Sempron | Intel Celeron |
| Architecture codename | Roma (2005) | Sandy Bridge (2011−2013) |
| Release date | 1 June 2005 (19 years ago) | 31 July 2012 (12 years ago) |
| Launch price (MSRP) | no data | $70 |
Detailed specifications
Mobile Sempron 3300+ and Celeron 807 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 1 (Single-Core) | 1 (Single-Core) |
| Threads | 1 | 2 |
| Base clock speed | no data | 1.5 GHz |
| Boost clock speed | 2 GHz | 1.5 GHz |
| Bus type | no data | DMI 2.0 |
| Bus rate | 800 MHz | 4 × 5 GT/s |
| Multiplier | no data | 15 |
| L1 cache | no data | 64 KB |
| L2 cache | 128 KB | 256 KB |
| L3 cache | no data | 1.5 MB |
| Chip lithography | 90 nm | 32 nm |
| Die size | no data | 131 mm2 |
| Maximum core temperature | no data | 100 °C |
| Number of transistors | no data | 504 million |
| 64 bit support | - | + |
| Windows 11 compatibility | - | - |
Compatibility
Information on Mobile Sempron 3300+ and Celeron 807 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | no data | 1 (Uniprocessor) |
| Socket | 745 | FCBGA1023 |
| Power consumption (TDP) | 62/25 Watt | 17 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Mobile Sempron 3300+ and Celeron 807. You'll probably need this information if you require some particular technology.
| Instruction set extensions | MMX, SSE, SSE2, SSE3 (Roma Core), Enhanced 3DNow!, NX bit | Intel® SSE4.1, Intel® SSE4.2 |
| FMA | - | + |
| Enhanced SpeedStep (EIST) | no data | + |
| My WiFi | no data | - |
| Turbo Boost Technology | no data | - |
| Hyper-Threading Technology | no data | + |
| Idle States | no data | + |
| Thermal Monitoring | - | + |
| Flex Memory Access | no data | + |
| Demand Based Switching | no data | - |
| FDI | no data | + |
| Fast Memory Access | no data | + |
| Status | no data | Discontinued |
Security technologies
Mobile Sempron 3300+ and Celeron 807 technologies aimed at improving security, for example, by protecting against hacks.
| TXT | no data | - |
| EDB | no data | + |
| Anti-Theft | no data | - |
Virtualization technologies
Virtual machine speed-up technologies supported by Mobile Sempron 3300+ and Celeron 807 are enumerated here.
| VT-d | no data | - |
| VT-x | no data | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Mobile Sempron 3300+ and Celeron 807. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | no data | DDR3 |
| Maximum memory size | no data | 16 GB |
| Max memory channels | no data | 2 |
| Maximum memory bandwidth | no data | 21.335 GB/s |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | no data | Intel® HD Graphics for 2nd Generation Intel® Processors |
| Graphics max frequency | no data | 950 MHz |
Graphics interfaces
Available interfaces and connections of Mobile Sempron 3300+ and Celeron 807 integrated GPUs.
| Number of displays supported | no data | 2 |
| eDP | no data | + |
| DisplayPort | - | + |
| HDMI | - | + |
| SDVO | no data | + |
| CRT | no data | + |
Peripherals
Specifications and connection of peripherals supported by Mobile Sempron 3300+ and Celeron 807.
| PCIe version | no data | 2.0 |
| PCI Express lanes | no data | 16 |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Passmark
Passmark CPU Mark is a widespread benchmark, consisting of 8 different types of workload, including integer and floating point math, extended instructions, compression, encryption and physics calculation. There is also one separate single-threaded scenario measuring single-core performance.
Pros & cons summary
| Recency | 1 June 2005 | 31 July 2012 |
| Threads | 1 | 2 |
| Chip lithography | 90 nm | 32 nm |
| Power consumption (TDP) | 62 Watt | 17 Watt |
Celeron 807 has an age advantage of 7 years, 100% more threads, a 181.3% more advanced lithography process, and 264.7% lower power consumption.
We couldn't decide between Mobile Sempron 3300+ and Celeron 807. We've got no test results to judge.
Should you still have questions on choice between Mobile Sempron 3300+ and Celeron 807, ask them in Comments section, and we shall answer.
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