i3-330M vs E2-9000
Aggregate performance score
Core i3-330M outperforms E2-9000 by a small 6% based on our aggregate benchmark results.
Primary details
Comparing E2-9000 and Core i3-330M processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 2781 | 2746 |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Laptop | Laptop |
| Series | Bristol Ridge | Intel Core i3 |
| Power efficiency | 5.74 | 1.75 |
| Architecture codename | Stoney Ridge (2016−2019) | Arrandale (2010−2011) |
| Release date | 1 June 2016 (8 years ago) | 7 January 2010 (14 years ago) |
| Launch price (MSRP) | no data | $49 |
Detailed specifications
E2-9000 and Core i3-330M basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 2 (Dual-core) | 2 (Dual-core) |
| Threads | 2 | 4 |
| Base clock speed | 1.8 GHz | 2.13 GHz |
| Boost clock speed | 2.2 GHz | 0.03 GHz |
| Bus type | no data | DMI 1.0 |
| Bus rate | no data | 1 × 2.5 GT/s |
| Multiplier | no data | 16 |
| L1 cache | no data | 128 KB |
| L2 cache | 1 MB | 512 KB |
| L3 cache | no data | 3 MB (shared) |
| Chip lithography | 28 nm | 32 nm |
| Die size | 124.5 mm2 | 81+114 mm2 |
| Maximum core temperature | 90 °C | 90 °C for rPGA, 105 °C for BGA |
| Number of transistors | 1200 Million | 382 million |
| 64 bit support | + | + |
| Windows 11 compatibility | - | - |
Compatibility
Information on E2-9000 and Core i3-330M compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | no data | 1 (Uniprocessor) |
| Socket | BGA | BGA1288,PGA988 |
| Power consumption (TDP) | 10 Watt | 35 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by E2-9000 and Core i3-330M. You'll probably need this information if you require some particular technology.
| Instruction set extensions | Virtualization, | Intel® SSE4.1, Intel® SSE4.2 |
| FMA | - | + |
| Enhanced SpeedStep (EIST) | no data | + |
| Turbo Boost Technology | no data | - |
| Hyper-Threading Technology | no data | + |
| Idle States | no data | + |
| Thermal Monitoring | - | + |
| Flex Memory Access | no data | + |
| PAE | no data | 36 Bit |
| FDI | no data | + |
| Fast Memory Access | no data | + |
Security technologies
E2-9000 and Core i3-330M technologies aimed at improving security, for example, by protecting against hacks.
| TXT | no data | - |
| EDB | no data | + |
Virtualization technologies
Virtual machine speed-up technologies supported by E2-9000 and Core i3-330M are enumerated here.
| AMD-V | + | - |
| VT-d | no data | - |
| VT-x | no data | + |
| EPT | no data | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by E2-9000 and Core i3-330M. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR4 | DDR3-800, DDR3-1066 |
| Maximum memory size | no data | 8 GB |
| Max memory channels | no data | 2 |
| Maximum memory bandwidth | no data | 17.051 GB/s |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | AMD Radeon R2 (Stoney Ridge) | Intel® HD Graphics for Previous Generation Intel® Processors |
| Clear Video | no data | + |
| Clear Video HD | no data | + |
| Graphics max frequency | no data | 667 MHz |
Graphics interfaces
Available interfaces and connections of E2-9000 and Core i3-330M integrated GPUs.
| Number of displays supported | no data | 2 |
Peripherals
Specifications and connection of peripherals supported by E2-9000 and Core i3-330M.
| PCIe version | no data | 2.0 |
| PCI Express lanes | no data | 16 |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Combined synthetic benchmark score
This is our combined benchmark performance rating. We are regularly improving our combining algorithms, but if you find some perceived inconsistencies, feel free to speak up in comments section, we usually fix problems quickly.
Passmark
Passmark CPU Mark is a widespread benchmark, consisting of 8 different types of workload, including integer and floating point math, extended instructions, compression, encryption and physics calculation. There is also one separate single-threaded scenario measuring single-core performance.
Cinebench 10 32-bit single-core
Cinebench R10 is an ancient ray tracing benchmark for processors by Maxon, authors of Cinema 4D. Its single core version uses just one CPU thread to render a futuristic looking motorcycle.
Cinebench 10 32-bit multi-core
Cinebench Release 10 Multi Core is a variant of Cinebench R10 using all the processor threads. Possible number of threads is limited by 16 in this version.
3DMark06 CPU
3DMark06 is a discontinued DirectX 9 benchmark suite from Futuremark. Its CPU part contains two scenarios, one dedicated to artificial intelligence pathfinding, another to game physics using PhysX package.
wPrime 32
wPrime 32M is a math multi-thread processor test, which calculates square roots of first 32 million integer numbers. Its result is measured in seconds, so that the less is benchmark result, the faster the processor.
Cinebench 11.5 64-bit multi-core
Cinebench Release 11.5 Multi Core is a variant of Cinebench R11.5 which uses all the processor threads. A maximum of 64 threads is supported in this version.
Pros & cons summary
| Performance score | 0.63 | 0.67 |
| Recency | 1 June 2016 | 7 January 2010 |
| Threads | 2 | 4 |
| Chip lithography | 28 nm | 32 nm |
| Power consumption (TDP) | 10 Watt | 35 Watt |
E2-9000 has an age advantage of 6 years, a 14.3% more advanced lithography process, and 250% lower power consumption.
i3-330M, on the other hand, has a 6.3% higher aggregate performance score, and 100% more threads.
Given the minimal performance differences, no clear winner can be declared between E2-9000 and Core i3-330M.
Should you still have questions on choice between E2-9000 and Core i3-330M, ask them in Comments section, and we shall answer.
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