Mobile Sempron SI-40 vs i3-2310E

Place in the ranking	2380	3239
Place by popularity	not in top-100	not in top-100
Market segment	Laptop	Laptop
Series	Intel Core i3	AMD Mobile Sempron
Power efficiency	3.13	0.76
Architecture codename	Sandy Bridge (2011−2013)	Sable (2008−2009)
Release date	1 February 2011 (13 years ago)	4 July 2008 (16 years ago)
Launch price (MSRP)	$225	no data

Detailed specifications

Core i3-2310E and Mobile Sempron SI-40 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	2 (Dual-core)	1 (Single-Core)
Threads	4	1
Base clock speed	2.1 GHz	no data
Boost clock speed	2.1 GHz	2 GHz
Bus type	DMI 2.0	no data
Bus rate	4 × 5 GT/s	1800 MHz
Multiplier	21	no data
L1 cache	64K (per core)	no data
L2 cache	256K (per core)	512 KB
L3 cache	3 MB (shared)	no data
Chip lithography	32 nm	65 nm
Die size	149 mm²	no data
Maximum core temperature	no data	100 °C
Number of transistors	624 million	no data
64 bit support	+	+
Windows 11 compatibility	-	-

Compatibility

Information on Core i3-2310E and Mobile Sempron SI-40 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1 (Uniprocessor)	no data
Socket	Intel BGA1023	S1g2
Power consumption (TDP)	35 Watt	25 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Core i3-2310E and Mobile Sempron SI-40. You'll probably need this information if you require some particular technology.

Instruction set extensions	no data	65 nm, 1.075 - 1.125V
FMA	+	-
AVX	+	-
Enhanced SpeedStep (EIST)	+	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Core i3-2310E and Mobile Sempron SI-40 are enumerated here.

VT-x

no data

Memory specs

Types, maximum amount and channel quantity of RAM supported by Core i3-2310E and Mobile Sempron SI-40. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR3	no data
Maximum memory size	16 GB	no data
Max memory channels	2	no data
Maximum memory bandwidth	21.335 GB/s	no data
ECC memory support	+	-

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card

Intel HD Graphics 3000

no data

Gaming performance

Pros & cons summary

Performance score	1.16	0.20
Recency	1 February 2011	4 July 2008
Physical cores	2	1
Threads	4	1
Chip lithography	32 nm	65 nm
Power consumption (TDP)	35 Watt	25 Watt

i3-2310E has a 480% higher aggregate performance score, an age advantage of 2 years, 100% more physical cores and 300% more threads, and a 103.1% more advanced lithography process.

Mobile Sempron SI-40, on the other hand, has 40% lower power consumption.

The Core i3-2310E is our recommended choice as it beats the Mobile Sempron SI-40 in performance tests.

Should you still have questions on choice between Core i3-2310E and Mobile Sempron SI-40, ask them in Comments section, and we shall answer.