EPYC 7H12 vs Celeron B810

Primary details

Comparing Celeron B810 and EPYC 7H12 processor market type (desktop or notebook), architecture, sales start time and price.

Place in the ranking	not rated	47
Place by popularity	not in top-100	not in top-100
Market segment	Laptop	Server
Series	Intel Celeron	AMD EPYC
Power efficiency	no data	14.82
Architecture codename	Sandy Bridge (2011−2013)	Zen 2 (2017−2020)
Release date	14 March 2011 (13 years ago)	18 September 2019 (5 years ago)
Launch price (MSRP)	$86	no data

Detailed specifications

Celeron B810 and EPYC 7H12 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	2 (Dual-core)	64 (Tetrahexaconta-Core)
Threads	2	128
Base clock speed	1.6 GHz	2.6 GHz
Boost clock speed	1.6 GHz	3.3 GHz
Bus type	DMI 2.0	no data
Bus rate	4 × 5 GT/s	no data
Multiplier	16	26
L1 cache	128 KB	96K (per core)
L2 cache	512 KB	512K (per core)
L3 cache	2 MB (shared)	256 MB (shared)
Chip lithography	32 nm	7 nm, 14 nm
Die size	131 mm2	192 mm2
Maximum core temperature	100 °C	no data
Number of transistors	504 million	4,800 million
64 bit support	+	+
Windows 11 compatibility	-	+
Unlocked multiplier	-	+

Compatibility

Information on Celeron B810 and EPYC 7H12 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1 (Uniprocessor)	2 (Multiprocessor)
Socket	PGA988	TR4
Power consumption (TDP)	35 Watt	280 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Celeron B810 and EPYC 7H12. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2	no data
AES-NI	-	+
FMA	+	-
AVX	-	+
Enhanced SpeedStep (EIST)	+	no data
My WiFi	-	no data
Turbo Boost Technology	-	no data
Hyper-Threading Technology	-	no data
Idle States	+	no data
Thermal Monitoring	+	-
Flex Memory Access	+	no data
Demand Based Switching	-	no data
FDI	+	no data
Fast Memory Access	+	no data
Precision Boost 2	no data	+

Security technologies

Celeron B810 and EPYC 7H12 technologies aimed at improving security, for example, by protecting against hacks.

TXT	-	no data
EDB	+	no data
Anti-Theft	-	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Celeron B810 and EPYC 7H12 are enumerated here.

AMD-V	-	+
VT-d	-	no data
VT-x	+	no data

Memory specs

Types, maximum amount and channel quantity of RAM supported by Celeron B810 and EPYC 7H12. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR3	DDR4 Eight-channel
Maximum memory size	16.6 GB	4 TiB
Max memory channels	2	8
Maximum memory bandwidth	21.335 GB/s	204.763 GB/s
ECC memory support	-	+

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card	Intel® HD Graphics for 2nd Generation Intel® Processors	no data
Graphics max frequency	950 MHz	no data

Graphics interfaces

Available interfaces and connections of Celeron B810 and EPYC 7H12 integrated GPUs.

Number of displays supported	2	no data
eDP	+	no data
DisplayPort	+	-
HDMI	+	-
SDVO	+	no data
CRT	+	no data

Peripherals

Specifications and connection of peripherals supported by Celeron B810 and EPYC 7H12.

PCIe version	2.0	no data
PCI Express lanes	16	no data

Synthetic benchmark performance

Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.

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Pros & cons summary

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Recency	14 March 2011	18 September 2019
Physical cores	2	64
Threads	2	128
Chip lithography	32 nm	7 nm
Power consumption (TDP)	35 Watt	280 Watt

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