i3-9000 vs Xeon W-2175
Primary details
Comparing Xeon W-2175 and Core i3-9000 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 480 | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Cost-effectiveness evaluation | 6.95 | no data |
| Market segment | Server | Desktop processor |
| Series | Intel Xeon W | Intel Core i3 |
| Power efficiency | 9.92 | no data |
| Architecture codename | Skylake (server) (2017−2018) | Coffee Lake (2017−2019) |
| Release date | 15 October 2017 (7 years ago) | 1 September 2018 (6 years ago) |
| Launch price (MSRP) | $1,947 | no data |
Cost-effectiveness evaluation
Performance per price, higher is better.
Detailed specifications
Xeon W-2175 and Core i3-9000 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 14 (Tetradeca-Core) | 4 (Quad-Core) |
| Threads | 28 | 4 |
| Base clock speed | 2.5 GHz | 3.7 GHz |
| Boost clock speed | 4.3 GHz | 3.7 GHz |
| Bus type | DMI 3.0 | DMI 3.0 |
| Bus rate | 4 × 8 GT/s | 4 × 8 GT/s |
| Multiplier | 25 | 37 |
| L1 cache | 64K (per core) | 64K (per core) |
| L2 cache | 1 MB (per core) | 256K (per core) |
| L3 cache | 19.25 MB (shared) | 6 MB (shared) |
| Chip lithography | 14 nm | 14 nm |
| Die size | 484 mm2 | 126 mm2 |
| Maximum case temperature (TCase) | 66 °C | 72 °C |
| 64 bit support | + | + |
| Windows 11 compatibility | + | - |
Compatibility
Information on Xeon W-2175 and Core i3-9000 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 (Uniprocessor) | 1 (Uniprocessor) |
| Socket | FCLGA2066 | 1151 |
| Power consumption (TDP) | 140 Watt | 65 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Xeon W-2175 and Core i3-9000. You'll probably need this information if you require some particular technology.
| Instruction set extensions | Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512 | no data |
| AES-NI | + | + |
| AVX | + | + |
| vPro | + | no data |
| Enhanced SpeedStep (EIST) | + | + |
| Speed Shift | + | no data |
| Turbo Boost Technology | 2.0 | no data |
| Hyper-Threading Technology | + | no data |
| TSX | + | - |
| Idle States | + | no data |
| Thermal Monitoring | + | - |
| Flex Memory Access | - | no data |
| Demand Based Switching | + | no data |
| PAE | 46 Bit | no data |
| Turbo Boost Max 3.0 | - | no data |
Security technologies
Xeon W-2175 and Core i3-9000 technologies aimed at improving security, for example, by protecting against hacks.
| TXT | + | no data |
| EDB | + | no data |
| Secure Key | + | no data |
| MPX | + | - |
| Identity Protection | + | - |
| SGX | - | no data |
| OS Guard | + | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by Xeon W-2175 and Core i3-9000 are enumerated here.
| VT-d | + | + |
| VT-x | + | + |
| EPT | + | no data |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Xeon W-2175 and Core i3-9000. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR4-1600, DDR4-1866, DDR4-2133, DDR4-2400, DDR4-2666 | DDR4 Dual-channel |
| Maximum memory size | 512 GB | 64 GB |
| Max memory channels | 4 | 2 |
| Maximum memory bandwidth | 85.33 GB/s | 38.397 GB/s |
| ECC memory support | + | + |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | no data | Intel UHD Graphics 630 |
Peripherals
Specifications and connection of peripherals supported by Xeon W-2175 and Core i3-9000.
| PCIe version | 3.0 | 3.0 |
| PCI Express lanes | 48 | no data |
Pros & cons summary
| Recency | 15 October 2017 | 1 September 2018 |
| Physical cores | 14 | 4 |
| Threads | 28 | 4 |
| Power consumption (TDP) | 140 Watt | 65 Watt |
Xeon W-2175 has 250% more physical cores and 600% more threads.
i3-9000, on the other hand, has an age advantage of 10 months, and 115.4% lower power consumption.
We couldn't decide between Xeon W-2175 and Core i3-9000. We've got no test results to judge.
Be aware that Xeon W-2175 is a server/workstation processor while Core i3-9000 is a desktop one.
Should you still have questions on choice between Xeon W-2175 and Core i3-9000, ask them in Comments section, and we shall answer.
Similar processor comparisons
We picked several similar comparisons of processors in the same market segment and performance relatively close to those reviewed on this page.
