Ryzen 9 3900X vs Xeon W-2145
Aggregate performance score
Ryzen 9 3900X outperforms Xeon W-2145 by an impressive 79% based on our aggregate benchmark results.
Primary details
Comparing Xeon W-2145 and Ryzen 9 3900X processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 680 | 269 |
| Place by popularity | not in top-100 | not in top-100 |
| Cost-effectiveness evaluation | 7.60 | 20.91 |
| Market segment | Server | Desktop processor |
| Series | Intel Xeon W | AMD Ryzen 9 |
| Power efficiency | 7.74 | 15.54 |
| Architecture codename | Skylake (server) (2017−2018) | Matisse (Zen 2) (2019−2020) |
| Release date | 29 August 2017 (7 years ago) | 7 July 2019 (5 years ago) |
| Launch price (MSRP) | $1,113 | $499 |
Cost-effectiveness evaluation
Performance per price, higher is better.
Ryzen 9 3900X has 175% better value for money than Xeon W-2145.
Detailed specifications
Xeon W-2145 and Ryzen 9 3900X basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 8 (Octa-Core) | 12 (Dodeca-Core) |
| Threads | 16 | 24 |
| Base clock speed | 3.7 GHz | 3.8 GHz |
| Boost clock speed | 4.5 GHz | 4.6 GHz |
| Bus type | DMI 3.0 | no data |
| Bus rate | 4 × 8 GT/s | no data |
| Multiplier | 37 | no data |
| L1 cache | 64K (per core) | 96K (per core) |
| L2 cache | 1 MB (per core) | 512K (per core) |
| L3 cache | 11 MB (shared) | 64 MB |
| Chip lithography | 14 nm | 7 nm, 12 nm |
| Die size | 484 mm2 | no data |
| Maximum core temperature | no data | 95 °C |
| Maximum case temperature (TCase) | 70 °C | no data |
| Number of transistors | no data | 19,200 million |
| 64 bit support | + | + |
| Windows 11 compatibility | + | + |
| Unlocked multiplier | - | + |
Compatibility
Information on Xeon W-2145 and Ryzen 9 3900X compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 (Uniprocessor) | 1 (Uniprocessor) |
| Socket | Socket R4 | AM4 |
| Power consumption (TDP) | 140 Watt | 125 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Xeon W-2145 and Ryzen 9 3900X. You'll probably need this information if you require some particular technology.
| Instruction set extensions | Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512 | no data |
| AES-NI | + | + |
| AVX | + | + |
| vPro | + | no data |
| Enhanced SpeedStep (EIST) | + | no data |
| Speed Shift | + | no data |
| Turbo Boost Technology | 2.0 | no data |
| Hyper-Threading Technology | + | no data |
| TSX | + | - |
| Idle States | + | no data |
| Thermal Monitoring | + | - |
| Flex Memory Access | - | no data |
| Demand Based Switching | + | no data |
| PAE | 46 Bit | no data |
| Turbo Boost Max 3.0 | - | no data |
| Precision Boost 2 | no data | + |
Security technologies
Xeon W-2145 and Ryzen 9 3900X technologies aimed at improving security, for example, by protecting against hacks.
| TXT | + | no data |
| EDB | + | no data |
| Secure Key | + | no data |
| MPX | + | - |
| Identity Protection | + | - |
| SGX | - | no data |
| OS Guard | + | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by Xeon W-2145 and Ryzen 9 3900X are enumerated here.
| AMD-V | + | + |
| VT-d | + | no data |
| VT-x | + | no data |
| EPT | + | no data |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Xeon W-2145 and Ryzen 9 3900X. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR4 | DDR4 Dual-channel |
| Maximum memory size | 512 GB | 128 GB |
| Max memory channels | 4 | 2 |
| Maximum memory bandwidth | 85.33 GB/s | 51.196 GB/s |
| ECC memory support | + | - |
Peripherals
Specifications and connection of peripherals supported by Xeon W-2145 and Ryzen 9 3900X.
| PCIe version | 3.0 | no data |
| PCI Express lanes | 48 | no data |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Combined synthetic benchmark score
This is our combined benchmark performance rating. We are regularly improving our combining algorithms, but if you find some perceived inconsistencies, feel free to speak up in comments section, we usually fix problems quickly.
Passmark
Passmark CPU Mark is a widespread benchmark, consisting of 8 different types of workload, including integer and floating point math, extended instructions, compression, encryption and physics calculation. There is also one separate single-threaded scenario measuring single-core performance.
GeekBench 5 Single-Core
GeekBench 5 Single-Core is a cross-platform application developed in the form of CPU tests that independently recreate certain real-world tasks with which to accurately measure performance. This version uses only a single CPU core.
GeekBench 5 Multi-Core
GeekBench 5 Multi-Core is a cross-platform application developed in the form of CPU tests that independently recreate certain real-world tasks with which to accurately measure performance. This version uses all available CPU cores.
Cinebench 15 64-bit multi-core
Cinebench Release 15 Multi Core is a variant of Cinebench R15 which uses all the processor threads.
Cinebench 15 64-bit single-core
Cinebench R15 (standing for Release 15) is a benchmark made by Maxon, authors of Cinema 4D. It was superseded by later versions of Cinebench, which use more modern variants of Cinema 4D engine. The Single Core version (sometimes called Single-Thread) only uses a single processor thread to render a room full of reflective spheres and light sources.
Geekbench 5.5 Multi-Core
Pros & cons summary
| Performance score | 11.45 | 20.53 |
| Recency | 29 August 2017 | 7 July 2019 |
| Physical cores | 8 | 12 |
| Threads | 16 | 24 |
| Chip lithography | 14 nm | 7 nm |
| Power consumption (TDP) | 140 Watt | 125 Watt |
Ryzen 9 3900X has a 79.3% higher aggregate performance score, an age advantage of 1 year, 50% more physical cores and 50% more threads, a 100% more advanced lithography process, and 12% lower power consumption.
The Ryzen 9 3900X is our recommended choice as it beats the Xeon W-2145 in performance tests.
Be aware that Xeon W-2145 is a server/workstation processor while Ryzen 9 3900X is a desktop one.
Should you still have questions on choice between Xeon W-2145 and Ryzen 9 3900X, ask them in Comments section, and we shall answer.
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