Xeon E7-8860 v3 vs E7-4890 v3
Primary details
Comparing Xeon E7-4890 v3 and Xeon E7-8860 v3 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | not rated | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Server | Server |
| Architecture codename | Haswell-EX (2015) | Haswell-EX (2015) |
| Release date | 1 June 2015 (9 years ago) | 1 June 2015 (9 years ago) |
Detailed specifications
Xeon E7-4890 v3 and Xeon E7-8860 v3 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 18 (Octadeca-Core) | 16 (Hexadeca-Core) |
| Threads | 36 | 32 |
| Base clock speed | 2.5 GHz | 2.2 GHz |
| Boost clock speed | 2.5 GHz | 3.2 GHz |
| Bus rate | no data | 9.6 GT/s |
| L1 cache | 64 KB (per core) | 64K (per core) |
| L2 cache | 256 KB (per core) | 256K (per core) |
| L3 cache | 45 MB (shared) | 40 MB (shared) |
| Chip lithography | 22 nm | 22 nm |
| Die size | 160 mm2 | 160 mm2 |
| Maximum case temperature (TCase) | no data | 75 °C |
| Number of transistors | 1,400 million | 1,400 million |
| 64 bit support | + | + |
| Windows 11 compatibility | - | - |
Compatibility
Information on Xeon E7-4890 v3 and Xeon E7-8860 v3 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 4 | 8 |
| Socket | 1150 | FCLGA2011 |
| Power consumption (TDP) | 165 Watt | 140 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Xeon E7-4890 v3 and Xeon E7-8860 v3. You'll probably need this information if you require some particular technology.
| Instruction set extensions | no data | Intel® AVX2 |
| AES-NI | + | + |
| AVX | + | + |
| vPro | + | + |
| Enhanced SpeedStep (EIST) | + | + |
| Turbo Boost Technology | no data | 2.0 |
| Hyper-Threading Technology | no data | + |
| TSX | - | + |
| Idle States | no data | + |
| Thermal Monitoring | - | + |
| PAE | no data | 46 Bit |
Security technologies
Xeon E7-4890 v3 and Xeon E7-8860 v3 technologies aimed at improving security, for example, by protecting against hacks.
| TXT | + | + |
| EDB | no data | + |
| Secure Key | no data | + |
| OS Guard | no data | + |
Virtualization technologies
Virtual machine speed-up technologies supported by Xeon E7-4890 v3 and Xeon E7-8860 v3 are enumerated here.
| VT-d | + | + |
| VT-x | + | + |
| EPT | no data | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Xeon E7-4890 v3 and Xeon E7-8860 v3. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR3, DDR4 | DDR4-1333/1600/1866, DDR3-1066/1333/1600 |
| Maximum memory size | no data | 1.5 TB |
| Max memory channels | no data | 4 |
| Maximum memory bandwidth | no data | 85 GB/s |
| ECC memory support | - | + |
Peripherals
Specifications and connection of peripherals supported by Xeon E7-4890 v3 and Xeon E7-8860 v3.
| PCIe version | 3.0 | 3.0 |
| PCI Express lanes | no data | 32 |
Pros & cons summary
| Physical cores | 18 | 16 |
| Threads | 36 | 32 |
| Power consumption (TDP) | 165 Watt | 140 Watt |
Xeon E7-4890 v3 has 12.5% more physical cores and 12.5% more threads.
Xeon E7-8860 v3, on the other hand, has 17.9% lower power consumption.
We couldn't decide between Xeon E7-4890 v3 and Xeon E7-8860 v3. We've got no test results to judge.
Should you still have questions on choice between Xeon E7-4890 v3 and Xeon E7-8860 v3, ask them in Comments section, and we shall answer.
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