Xeon E-2224 vs Ryzen AI 9 HX 370
Aggregate performance score
Ryzen AI 9 HX 370 outperforms Xeon E-2224 by a whopping 384% based on our aggregate benchmark results.
Primary details
Comparing Ryzen AI 9 HX 370 and Xeon E-2224 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 249 | 1349 |
| Place by popularity | not in top-100 | not in top-100 |
| Cost-effectiveness evaluation | no data | 22.79 |
| Market segment | Laptop | Server |
| Series | no data | Intel Xeon E |
| Power efficiency | 74.82 | 6.10 |
| Architecture codename | Strix Point (2024−2025) | Coffee Lake-S WS (2018−2019) |
| Release date | July 2024 (recently) | 29 May 2019 (5 years ago) |
| Launch price (MSRP) | no data | $193 |
Cost-effectiveness evaluation
Performance per price, higher is better.
Detailed specifications
Ryzen AI 9 HX 370 and Xeon E-2224 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 12 (Dodeca-Core) | 4 (Quad-Core) |
| Threads | 24 | 4 |
| Base clock speed | 2 GHz | 3.4 GHz |
| Boost clock speed | 5.1 GHz | 4.6 GHz |
| Bus type | no data | DMI 3.0 |
| Bus rate | 54 MHz | 4 × 8 GT/s |
| Multiplier | no data | 34 |
| L1 cache | 80 KB (per core) | 64 KB (per core) |
| L2 cache | 1 MB (per core) | 256 KB (per core) |
| L3 cache | 24 MB (shared) | 8 MB (shared) |
| Chip lithography | 4 nm | 14 nm |
| Die size | 233 mm2 | 126 mm2 |
| Maximum core temperature | 100 °C | 100 °C |
| 64 bit support | + | + |
| Windows 11 compatibility | no data | + |
Compatibility
Information on Ryzen AI 9 HX 370 and Xeon E-2224 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | 1 (Uniprocessor) |
| Socket | FP8 | FCLGA1151 |
| Power consumption (TDP) | 28 Watt | 71 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Ryzen AI 9 HX 370 and Xeon E-2224. You'll probably need this information if you require some particular technology.
| Instruction set extensions | USB 4, XDNA 2 NPU (50 TOPS), SMT, AES, AVX, AVX2, AVX512, FMA3, MMX (+), SHA, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
| AES-NI | + | + |
| AVX | + | + |
| vPro | no data | + |
| Enhanced SpeedStep (EIST) | no data | + |
| Turbo Boost Technology | no data | 2.0 |
| Hyper-Threading Technology | no data | - |
| TSX | - | + |
| Idle States | no data | + |
| Thermal Monitoring | - | + |
| Precision Boost 2 | + | no data |
Security technologies
Ryzen AI 9 HX 370 and Xeon E-2224 technologies aimed at improving security, for example, by protecting against hacks.
| TXT | no data | + |
| EDB | no data | + |
| Secure Key | no data | + |
| MPX | - | + |
| SGX | no data | Yes with Intel® ME |
| OS Guard | no data | + |
Virtualization technologies
Virtual machine speed-up technologies supported by Ryzen AI 9 HX 370 and Xeon E-2224 are enumerated here.
| AMD-V | + | - |
| VT-d | no data | + |
| VT-x | no data | + |
| EPT | no data | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Ryzen AI 9 HX 370 and Xeon E-2224. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR5 | DDR4-2666 |
| Maximum memory size | no data | 128 GB |
| Max memory channels | no data | 2 |
| Maximum memory bandwidth | no data | 42.671 GB/s |
| ECC memory support | - | + |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card Compare | AMD Radeon 890M | Intel UHD Graphics P630 |
Graphics image quality
Maximum display resolutions supported by Ryzen AI 9 HX 370 and Xeon E-2224 integrated GPUs, including resolutions over different interfaces.
| Max resolution over HDMI 1.4 | no data | N/A |
| Max resolution over eDP | no data | N/A |
| Max resolution over DisplayPort | no data | N/A |
| Max resolution over VGA | no data | N/A |
Graphics API support
APIs supported by Ryzen AI 9 HX 370 and Xeon E-2224 integrated GPUs, sometimes API versions are included.
| DirectX | no data | N/A |
| OpenGL | no data | N/A |
Peripherals
Specifications and connection of peripherals supported by Ryzen AI 9 HX 370 and Xeon E-2224.
| PCIe version | 4.0 | 3.0 |
| PCI Express lanes | 16 | 16 |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Combined synthetic benchmark score
This is our combined benchmark performance rating.
Passmark
Passmark CPU Mark is a widespread benchmark, consisting of 8 different types of workload, including integer and floating point math, extended instructions, compression, encryption and physics calculation. There is also one separate single-threaded scenario measuring single-core performance.
Pros & cons summary
| Performance score | 22.00 | 4.55 |
| Integrated graphics card | 21.89 | 6.41 |
| Physical cores | 12 | 4 |
| Threads | 24 | 4 |
| Chip lithography | 4 nm | 14 nm |
| Power consumption (TDP) | 28 Watt | 71 Watt |
Ryzen AI 9 HX 370 has a 383.5% higher aggregate performance score, 241.5% faster integrated GPU, 200% more physical cores and 500% more threads, a 250% more advanced lithography process, and 153.6% lower power consumption.
The Ryzen AI 9 HX 370 is our recommended choice as it beats the Xeon E-2224 in performance tests.
Be aware that Ryzen AI 9 HX 370 is a notebook processor while Xeon E-2224 is a server/workstation one.
Other comparisons
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