Ryzen 9 7900X3D vs i7-870
Aggregate performance score
Ryzen 9 7900X3D outperforms Core i7-870 by a whopping 1507% based on our aggregate benchmark results.
Primary details
Comparing Core i7-870 and Ryzen 9 7900X3D processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 1922 | 127 |
| Place by popularity | not in top-100 | not in top-100 |
| Cost-effectiveness evaluation | 0.20 | 49.14 |
| Market segment | Desktop processor | Desktop processor |
| Series | no data | AMD Ryzen 9 |
| Power efficiency | 1.97 | 25.03 |
| Architecture codename | Lynnfield (2009−2010) | Raphael (2023−2024) |
| Release date | 8 September 2009 (15 years ago) | 4 January 2023 (1 year ago) |
| Launch price (MSRP) | $305 | $599 |
Cost-effectiveness evaluation
Performance per price, higher is better.
Ryzen 9 7900X3D has 24470% better value for money than i7-870.
Detailed specifications
Core i7-870 and Ryzen 9 7900X3D basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 4 (Quad-Core) | 12 (Dodeca-Core) |
| Threads | 8 | 24 |
| Base clock speed | 2.93 GHz | 4.4 GHz |
| Boost clock speed | 3.6 GHz | 5.6 GHz |
| Bus rate | 2.5 GT/s | no data |
| L1 cache | 64 KB (per core) | 768 KB |
| L2 cache | 256 KB (per core) | 12 MB |
| L3 cache | 8 MB (shared) | 128 MB (shared) |
| Chip lithography | 45 nm | 5 nm, 6 nm |
| Die size | 296 mm2 | 71+71+122 mm |
| Maximum core temperature | 73 °C | no data |
| Maximum case temperature (TCase) | no data | 47 °C |
| Number of transistors | 774 million | 13,140 million |
| 64 bit support | + | + |
| Windows 11 compatibility | - | + |
| Unlocked multiplier | - | + |
Compatibility
Information on Core i7-870 and Ryzen 9 7900X3D compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | 1 |
| Socket | FCLGA1156,LGA1156 | AM5 |
| Power consumption (TDP) | 95 Watt | 120 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Core i7-870 and Ryzen 9 7900X3D. You'll probably need this information if you require some particular technology.
| Instruction set extensions | Intel® SSE4.2 | no data |
| AES-NI | - | + |
| AVX | - | + |
| Enhanced SpeedStep (EIST) | + | no data |
| Turbo Boost Technology | 1.0 | no data |
| Hyper-Threading Technology | + | no data |
| Idle States | + | no data |
| Demand Based Switching | - | no data |
| PAE | 36 Bit | no data |
| Precision Boost 2 | no data | + |
Security technologies
Core i7-870 and Ryzen 9 7900X3D technologies aimed at improving security, for example, by protecting against hacks.
| TXT | + | no data |
| EDB | + | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by Core i7-870 and Ryzen 9 7900X3D are enumerated here.
| AMD-V | - | + |
| VT-d | + | no data |
| VT-x | + | no data |
| EPT | + | no data |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Core i7-870 and Ryzen 9 7900X3D. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR3 | DDR5-5200 |
| Maximum memory size | 16 GB | 128 GB |
| Max memory channels | 2 | no data |
| Maximum memory bandwidth | 21 GB/s | no data |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | N/A | AMD Radeon Graphics |
Peripherals
Specifications and connection of peripherals supported by Core i7-870 and Ryzen 9 7900X3D.
| PCIe version | 2.0 | 5.0 |
| PCI Express lanes | 16 | 24 |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Combined synthetic benchmark score
This is our combined benchmark performance rating. We are regularly improving our combining algorithms, but if you find some perceived inconsistencies, feel free to speak up in comments section, we usually fix problems quickly.
Passmark
Passmark CPU Mark is a widespread benchmark, consisting of 8 different types of workload, including integer and floating point math, extended instructions, compression, encryption and physics calculation. There is also one separate single-threaded scenario measuring single-core performance.
GeekBench 5 Single-Core
GeekBench 5 Single-Core is a cross-platform application developed in the form of CPU tests that independently recreate certain real-world tasks with which to accurately measure performance. This version uses only a single CPU core.
GeekBench 5 Multi-Core
GeekBench 5 Multi-Core is a cross-platform application developed in the form of CPU tests that independently recreate certain real-world tasks with which to accurately measure performance. This version uses all available CPU cores.
Pros & cons summary
| Performance score | 2.05 | 32.94 |
| Recency | 8 September 2009 | 4 January 2023 |
| Physical cores | 4 | 12 |
| Threads | 8 | 24 |
| Chip lithography | 45 nm | 5 nm |
| Power consumption (TDP) | 95 Watt | 120 Watt |
i7-870 has 26.3% lower power consumption.
Ryzen 9 7900X3D, on the other hand, has a 1506.8% higher aggregate performance score, an age advantage of 13 years, 200% more physical cores and 200% more threads, and a 800% more advanced lithography process.
The Ryzen 9 7900X3D is our recommended choice as it beats the Core i7-870 in performance tests.
Should you still have questions on choice between Core i7-870 and Ryzen 9 7900X3D, ask them in Comments section, and we shall answer.
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