Ryzen Embedded 8845HS vs i7-2630QM

Primary details

Comparing Core i7-2630QM and Ryzen Embedded 8845HS processor market type (desktop or notebook), architecture, sales start time and price.

Place in performance ranking	1785	not rated
Place by popularity	not in top-100	not in top-100
Market segment	Laptop	Server
Series	Intel Core i7	no data
Architecture codename	Sandy Bridge (2011−2013)	Hawk Point (2024)
Release date	3 January 2011 (13 years ago)	2 April 2024 (less than a year ago)
Launch price (MSRP)	$378	no data

Detailed specifications

Core i7-2630QM and Ryzen Embedded 8845HS basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	4 (Quad-Core)	8 (Octa-Core)
Threads	8	16
Base clock speed	2 GHz	3.8 GHz
Boost clock speed	2.9 GHz	5.1 GHz
Bus type	DMI 2.0	no data
Bus rate	4 × 5 GT/s	no data
Multiplier	20	no data
L1 cache	256 KB	64 KB (per core)
L2 cache	1 MB	1 MB (per core)
L3 cache	6 MB	16 MB (shared)
Chip lithography	32 nm	4 nm
Die size	216 mm2	178 mm2
Maximum core temperature	100 °C	no data
Number of transistors	1160 Million	25,000 million
64 bit support	+	+
Windows 11 compatibility	-	no data

Compatibility

Information on Core i7-2630QM and Ryzen Embedded 8845HS compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1 (Uniprocessor)	1
Socket	FCPGA988,PPGA988	FP8
Power consumption (TDP)	45 Watt	45 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Core i7-2630QM and Ryzen Embedded 8845HS. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® AVX	no data
AES-NI	+	+
FMA	+	-
AVX	+	+
Enhanced SpeedStep (EIST)	+	no data
My WiFi	+	no data
Turbo Boost Technology	2.0	no data
Hyper-Threading Technology	+	no data
Idle States	+	no data
Thermal Monitoring	+	-
Flex Memory Access	+	no data
Demand Based Switching	-	no data
FDI	+	no data
Fast Memory Access	+	no data
Status	Discontinued	no data
Precision Boost 2	no data	+

Security technologies

Core i7-2630QM and Ryzen Embedded 8845HS technologies aimed at improving security, for example, by protecting against hacks.

TXT	-	no data
EDB	+	no data
Identity Protection	+	-
Anti-Theft	+	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Core i7-2630QM and Ryzen Embedded 8845HS are enumerated here.

AMD-V	-	+
VT-d	-	no data
VT-x	+	no data
EPT	+	no data

Memory specs

Types, maximum amount and channel quantity of RAM supported by Core i7-2630QM and Ryzen Embedded 8845HS. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR3-1066, DDR3-1333	DDR5
Maximum memory size	16 GB	no data
Max memory channels	2	no data
Maximum memory bandwidth	21.335 GB/s	no data

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card Compare	Intel HD Graphics 3000	AMD Radeon 780M
Quick Sync Video	+	-
Clear Video HD	+	no data
Graphics max frequency	1.1 GHz	no data
InTru 3D	+	no data

Graphics interfaces

Available interfaces and connections of Core i7-2630QM and Ryzen Embedded 8845HS integrated GPUs.

Number of displays supported	2	no data
eDP	+	no data
DisplayPort	+	-
HDMI	+	-
SDVO	+	no data
CRT	+	no data

Peripherals

Specifications and connection of peripherals supported by Core i7-2630QM and Ryzen Embedded 8845HS.

PCIe version	2.0	4.0
PCI Express lanes	16	20

Pros & cons summary

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Integrated graphics card	0.66	18.30
Recency	3 January 2011	2 April 2024
Physical cores	4	8
Threads	8	16
Chip lithography	32 nm	4 nm

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