Mobile Sempron 3300+ vs i3-4170

Primary details

Comparing Core i3-4170 and Mobile Sempron 3300+ processor market type (desktop or notebook), architecture, sales start time and price.

Place in the ranking	1820	3256
Place by popularity	not in top-100	not in top-100
Cost-effectiveness evaluation	0.55	no data
Market segment	Desktop processor	Laptop
Series	no data	AMD Mobile Sempron
Power efficiency	3.99	0.29
Architecture codename	Haswell (2013−2015)	Roma (2005)
Release date	1 May 2014 (10 years ago)	1 June 2005 (19 years ago)
Launch price (MSRP)	$117	no data

Cost-effectiveness evaluation

Performance per price, higher is better.

Detailed specifications

Core i3-4170 and Mobile Sempron 3300+ basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	2 (Dual-core)	1 (Single-Core)
Threads	4	1
Base clock speed	3.7 GHz	no data
Boost clock speed	3.7 GHz	2 GHz
Bus rate	5 GT/s	800 MHz
L1 cache	64 KB (per core)	no data
L2 cache	256 KB (per core)	128 KB
L3 cache	3 MB (shared)	no data
Chip lithography	22 nm	90 nm
Die size	177 mm2	no data
Maximum case temperature (TCase)	72 °C	no data
Number of transistors	1,400 million	no data
64 bit support	+	-
Windows 11 compatibility	-	-

Compatibility

Information on Core i3-4170 and Mobile Sempron 3300+ compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1	no data
Socket	FCLGA1150	745
Power consumption (TDP)	54 Watt	62/25 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Core i3-4170 and Mobile Sempron 3300+. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2	MMX, SSE, SSE2, SSE3 (Roma Core), Enhanced 3DNow!, NX bit
AES-NI	+	-
AVX	+	-
Enhanced SpeedStep (EIST)	+	no data
Turbo Boost Technology	-	no data
Hyper-Threading Technology	+	no data
Idle States	+	no data
Thermal Monitoring	+	-

Security technologies

Core i3-4170 and Mobile Sempron 3300+ technologies aimed at improving security, for example, by protecting against hacks.

TXT	-	no data
EDB	+	no data
Secure Key	+	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Core i3-4170 and Mobile Sempron 3300+ are enumerated here.

VT-d	-	no data
VT-x	+	no data
EPT	+	no data

Memory specs

Types, maximum amount and channel quantity of RAM supported by Core i3-4170 and Mobile Sempron 3300+. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR3-1333/1600, DDR3L-1333/1600	no data
Maximum memory size	32 GB	no data
Max memory channels	2	no data
Maximum memory bandwidth	25.6 GB/s	no data
ECC memory support	+	-

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card	Intel HD Graphics 4400	no data
Max video memory	2 GB	no data
Quick Sync Video	+	-
Clear Video HD	+	no data
Graphics max frequency	1.15 GHz	no data
InTru 3D	+	no data

Graphics interfaces

Available interfaces and connections of Core i3-4170 and Mobile Sempron 3300+ integrated GPUs.

Number of displays supported	3	no data
eDP	+	no data
DisplayPort	+	-
HDMI	+	-
DVI	+	no data
VGA	+	no data

Graphics image quality

Maximum display resolutions supported by Core i3-4170 and Mobile Sempron 3300+ integrated GPUs, including resolutions over different interfaces.

Max resolution over HDMI 1.4	4096x2304@24Hz	no data
Max resolution over eDP	3840x2160@60Hz	no data
Max resolution over DisplayPort	3840x2160@60Hz	no data
Max resolution over VGA	1920x1200@60Hz	no data

Graphics API support

APIs supported by Core i3-4170 and Mobile Sempron 3300+ integrated GPUs, sometimes API versions are included.

DirectX	11.1/12	no data
OpenGL	4.3	no data

Peripherals

Specifications and connection of peripherals supported by Core i3-4170 and Mobile Sempron 3300+.

PCIe version	Up to 3.0	no data
PCI Express lanes	16	no data

Synthetic benchmark performance

Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.

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Combined synthetic benchmark score

This is our combined benchmark performance rating. We are regularly improving our combining algorithms, but if you find some perceived inconsistencies, feel free to speak up in comments section, we usually fix problems quickly.

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Pros & cons summary

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Performance score	2.28	0.19
Recency	1 May 2014	1 June 2005
Physical cores	2	1
Threads	4	1
Chip lithography	22 nm	90 nm
Power consumption (TDP)	54 Watt	62 Watt

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Should you still have questions on choice between Core i3-4170 and Mobile Sempron 3300+, ask them in Comments section, and we shall answer.

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