Mobile Sempron SI-40 vs i3-370M

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Primary details

Comparing Core i3-370M and Mobile Sempron SI-40 processor market type (desktop or notebook), architecture, sales start time and price.

Place in the ranking2669not rated
Place by popularitynot in top-100not in top-100
Market segmentLaptopLaptop
SeriesIntel Core i3AMD Mobile Sempron
Power efficiency1.98no data
Architecture codenameArrandale (2010−2011)Sable (2008−2009)
Release date22 June 2010 (14 years ago)4 July 2008 (16 years ago)
Launch price (MSRP)$245no data

Detailed specifications

Core i3-370M and Mobile Sempron SI-40 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores2 (Dual-core)1 (Single-Core)
Threads41
Base clock speed2.4 GHzno data
Boost clock speed0.1 GHz2 GHz
Bus typeDMI 1.0no data
Bus rate1 × 2.5 GT/s1800 MHz
Multiplier18no data
L1 cache128 KBno data
L2 cache512 KB512 KB
L3 cache3 MB (shared)no data
Chip lithography32 nm65 nm
Die size81+114 mm2no data
Maximum core temperature90 °C for rPGA, 105 °C for BGA100 °C
Number of transistors382+177 Millionno data
64 bit support++
Windows 11 compatibility--

Compatibility

Information on Core i3-370M and Mobile Sempron SI-40 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration1 (Uniprocessor)no data
SocketPGA988S1g2
Power consumption (TDP)35 Watt25 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Core i3-370M and Mobile Sempron SI-40. You'll probably need this information if you require some particular technology.

Instruction set extensionsIntel® SSE4.1, Intel® SSE4.265 nm, 1.075 - 1.125V
FMA+-
Enhanced SpeedStep (EIST)+no data
Turbo Boost Technology-no data
Hyper-Threading Technology+no data
Idle States+no data
Thermal Monitoring+-
Flex Memory Access+no data
PAE36 Bitno data
FDI+no data
Fast Memory Access+no data

Security technologies

Core i3-370M and Mobile Sempron SI-40 technologies aimed at improving security, for example, by protecting against hacks.

TXT-no data
EDB+no data

Virtualization technologies

Virtual machine speed-up technologies supported by Core i3-370M and Mobile Sempron SI-40 are enumerated here.

VT-d-no data
VT-x+no data
EPT+no data

Memory specs

Types, maximum amount and channel quantity of RAM supported by Core i3-370M and Mobile Sempron SI-40. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory typesDDR3no data
Maximum memory size8 GBno data
Max memory channels2no data
Maximum memory bandwidth17.051 GB/sno data

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics cardIntel® HD Graphics for Previous Generation Intel® Processorsno data
Clear Video+no data
Clear Video HD+no data
Graphics max frequency667 MHzno data

Graphics interfaces

Available interfaces and connections of Core i3-370M and Mobile Sempron SI-40 integrated GPUs.

Number of displays supported2no data

Peripherals

Specifications and connection of peripherals supported by Core i3-370M and Mobile Sempron SI-40.

PCIe version2.0no data
PCI Express lanes16no data

Synthetic benchmark performance

Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.



3DMark06 CPU

3DMark06 is a discontinued DirectX 9 benchmark suite from Futuremark. Its CPU part contains two scenarios, one dedicated to artificial intelligence pathfinding, another to game physics using PhysX package.

i3-370M 2578
+234%
Mobile Sempron SI-40 772

Pros & cons summary


Recency 22 June 2010 4 July 2008
Physical cores 2 1
Threads 4 1
Chip lithography 32 nm 65 nm
Power consumption (TDP) 35 Watt 25 Watt

i3-370M has an age advantage of 1 year, 100% more physical cores and 300% more threads, and a 103.1% more advanced lithography process.

Mobile Sempron SI-40, on the other hand, has 40% lower power consumption.

We couldn't decide between Core i3-370M and Mobile Sempron SI-40. We've got no test results to judge.


Should you still have questions on choice between Core i3-370M and Mobile Sempron SI-40, ask them in Comments section, and we shall answer.

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Intel Core i3-370M
Core i3-370M
AMD Mobile Sempron SI-40
Mobile Sempron SI-40

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Community ratings

Here you can see how users rate the processors, as well as rate them yourself.


3.3 505 votes

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3.7 35 votes

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Questions & comments

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