Mobile Sempron SI-40 vs i3-370M
Aggregate performance score
Core i3-370M outperforms Mobile Sempron SI-40 by a whopping 265% based on our aggregate benchmark results.
Primary details
Comparing Core i3-370M and Mobile Sempron SI-40 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 2675 | 3216 |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Laptop | Laptop |
| Series | Intel Core i3 | AMD Mobile Sempron |
| Power efficiency | 1.97 | 0.76 |
| Architecture codename | Arrandale (2010−2011) | Sable (2008−2009) |
| Release date | 20 June 2010 (14 years ago) | 4 July 2008 (16 years ago) |
| Launch price (MSRP) | $245 | no data |
Detailed specifications
Core i3-370M and Mobile Sempron SI-40 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 2 (Dual-core) | 1 (Single-Core) |
| Threads | 4 | 1 |
| Base clock speed | 2.4 GHz | no data |
| Boost clock speed | 2.4 GHz | 2 GHz |
| Bus type | DMI 1.0 | no data |
| Bus rate | 1 × 2.5 GT/s | 1800 MHz |
| Multiplier | 18 | no data |
| L1 cache | 64K (per core) | no data |
| L2 cache | 256K (per core) | 512 KB |
| L3 cache | 3 MB (shared) | no data |
| Chip lithography | 32 nm | 65 nm |
| Die size | 81+114 mm2 | no data |
| Maximum core temperature | 90 °C for rPGA, 105 °C for BGA | 100 °C |
| Number of transistors | 382+177 Million | no data |
| 64 bit support | + | + |
| Windows 11 compatibility | - | - |
Compatibility
Information on Core i3-370M and Mobile Sempron SI-40 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 (Uniprocessor) | no data |
| Socket | PGA988 | S1g2 |
| Power consumption (TDP) | 35 Watt | 25 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Core i3-370M and Mobile Sempron SI-40. You'll probably need this information if you require some particular technology.
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | 65 nm, 1.075 - 1.125V |
| FMA | + | - |
| Enhanced SpeedStep (EIST) | + | no data |
| Turbo Boost Technology | - | no data |
| Hyper-Threading Technology | + | no data |
| Idle States | + | no data |
| Thermal Monitoring | + | - |
| Flex Memory Access | + | no data |
| PAE | 36 Bit | no data |
| FDI | + | no data |
| Fast Memory Access | + | no data |
Security technologies
Core i3-370M and Mobile Sempron SI-40 technologies aimed at improving security, for example, by protecting against hacks.
| TXT | - | no data |
| EDB | + | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by Core i3-370M and Mobile Sempron SI-40 are enumerated here.
| VT-d | - | no data |
| VT-x | + | no data |
| EPT | + | no data |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Core i3-370M and Mobile Sempron SI-40. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR3 | no data |
| Maximum memory size | 8 GB | no data |
| Max memory channels | 2 | no data |
| Maximum memory bandwidth | 17.051 GB/s | no data |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | Intel HD Graphics for Previous Generation Intel Processors | no data |
| Clear Video | + | no data |
| Clear Video HD | + | no data |
| Graphics max frequency | 667 MHz | no data |
Graphics interfaces
Available interfaces and connections of Core i3-370M and Mobile Sempron SI-40 integrated GPUs.
| Number of displays supported | 2 | no data |
Peripherals
Specifications and connection of peripherals supported by Core i3-370M and Mobile Sempron SI-40.
| PCIe version | 2.0 | no data |
| PCI Express lanes | 16 | no data |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Combined synthetic benchmark score
This is our combined benchmark performance rating. We are regularly improving our combining algorithms, but if you find some perceived inconsistencies, feel free to speak up in comments section, we usually fix problems quickly.
3DMark06 CPU
3DMark06 is a discontinued DirectX 9 benchmark suite from Futuremark. Its CPU part contains two scenarios, one dedicated to artificial intelligence pathfinding, another to game physics using PhysX package.
Pros & cons summary
| Performance score | 0.73 | 0.20 |
| Recency | 20 June 2010 | 4 July 2008 |
| Physical cores | 2 | 1 |
| Threads | 4 | 1 |
| Chip lithography | 32 nm | 65 nm |
| Power consumption (TDP) | 35 Watt | 25 Watt |
i3-370M has a 265% higher aggregate performance score, an age advantage of 1 year, 100% more physical cores and 300% more threads, and a 103.1% more advanced lithography process.
Mobile Sempron SI-40, on the other hand, has 40% lower power consumption.
The Core i3-370M is our recommended choice as it beats the Mobile Sempron SI-40 in performance tests.
Should you still have questions on choice between Core i3-370M and Mobile Sempron SI-40, ask them in Comments section, and we shall answer.
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