Mobile Sempron 2700+ vs i3-330UM

Primary details

Comparing Core i3-330UM and Mobile Sempron 2700+ processor market type (desktop or notebook), architecture, sales start time and price.

Place in the ranking	not rated	not rated
Place by popularity	not in top-100	not in top-100
Market segment	Laptop	Laptop
Series	Intel Core i3	Mobile Sempron
Architecture codename	Arrandale (2010−2011)	Georgetown
Release date	24 May 2010 (14 years ago)	no data (2024 years ago)

Detailed specifications

Core i3-330UM and Mobile Sempron 2700+ basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	2 (Dual-core)	1 (Single-Core)
Threads	4	1
Base clock speed	1.2 GHz	no data
Boost clock speed	0.1 GHz	1.6 GHz
Bus type	DMI 1.0	no data
Bus rate	1 × 2.5 GT/s	800 MHz
Multiplier	9	no data
L1 cache	128 KB	no data
L2 cache	512 KB	no data
L3 cache	3 MB	no data
Chip lithography	32 nm	no data
Die size	81+114 mm2	no data
Maximum core temperature	105 °C	no data
Number of transistors	382+177 Million	no data
64 bit support	+	-
Windows 11 compatibility	-	-

Compatibility

Information on Core i3-330UM and Mobile Sempron 2700+ compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1 (Uniprocessor)	no data
Socket	BGA1288	no data
Power consumption (TDP)	18 Watt	62 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Core i3-330UM and Mobile Sempron 2700+. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2	no data
FMA	+	-
Enhanced SpeedStep (EIST)	+	no data
Turbo Boost Technology	-	no data
Hyper-Threading Technology	+	no data
Idle States	+	no data
Thermal Monitoring	+	-
Flex Memory Access	+	no data
PAE	36 Bit	no data
FDI	+	no data
Fast Memory Access	+	no data

Security technologies

Core i3-330UM and Mobile Sempron 2700+ technologies aimed at improving security, for example, by protecting against hacks.

TXT	-	no data
EDB	+	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Core i3-330UM and Mobile Sempron 2700+ are enumerated here.

VT-d	-	no data
VT-x	+	no data
EPT	+	no data

Memory specs

Types, maximum amount and channel quantity of RAM supported by Core i3-330UM and Mobile Sempron 2700+. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR3	no data
Maximum memory size	8 GB	no data
Max memory channels	2	no data
Maximum memory bandwidth	12.799 GB/s	no data

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card	Intel® HD Graphics for Previous Generation Intel® Processors	no data
Clear Video	+	no data
Clear Video HD	+	no data
Graphics max frequency	500 MHz	no data

Graphics interfaces

Available interfaces and connections of Core i3-330UM and Mobile Sempron 2700+ integrated GPUs.

Number of displays supported

2

no data

Peripherals

Specifications and connection of peripherals supported by Core i3-330UM and Mobile Sempron 2700+.

PCIe version	2.0	no data
PCI Express lanes	16	no data

Pros & cons summary

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Physical cores	2	1
Threads	4	1
Power consumption (TDP)	18 Watt	62 Watt

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Should you still have questions on choice between Core i3-330UM and Mobile Sempron 2700+, ask them in Comments section, and we shall answer.

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