Mobile Sempron SI-40 vs Core 2 Duo P8700
Primary details
Comparing Core 2 Duo P8700 and Mobile Sempron SI-40 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in performance ranking | 2758 | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Laptop | Laptop |
| Series | Intel Core 2 Duo | AMD Mobile Sempron |
| Architecture codename | Penryn (2008−2011) | Sable (2008−2009) |
| Release date | 1 January 2009 (15 years ago) | 4 July 2008 (16 years ago) |
| Launch price (MSRP) | $209 | no data |
Detailed specifications
Core 2 Duo P8700 and Mobile Sempron SI-40 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 2 (Dual-core) | 1 (Single-Core) |
| Threads | 2 | 1 |
| Base clock speed | 2.53 GHz | no data |
| Boost clock speed | 2.53 GHz | 2 GHz |
| Bus rate | 1066 MHz | 1800 MHz |
| L2 cache | 3 MB | 512 KB |
| L3 cache | 3 MB L2 Cache | no data |
| Chip lithography | 45 nm | 65 nm |
| Die size | 107 mm2 | no data |
| Maximum core temperature | 105 °C | 100 °C |
| Number of transistors | 410 Million | no data |
| 64 bit support | + | + |
| Windows 11 compatibility | - | - |
| VID voltage range | 1V - 1.25V | no data |
Compatibility
Information on Core 2 Duo P8700 and Mobile Sempron SI-40 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Socket | BGA479,PGA478 | S1g2 |
| Power consumption (TDP) | 25 Watt | 25 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Core 2 Duo P8700 and Mobile Sempron SI-40. You'll probably need this information if you require some particular technology.
| Instruction set extensions | no data | 65 nm, 1.075 - 1.125V |
| Enhanced SpeedStep (EIST) | + | no data |
| Turbo Boost Technology | - | no data |
| Hyper-Threading Technology | - | no data |
| Idle States | + | no data |
| Demand Based Switching | - | no data |
| FSB parity | - | no data |
| Status | Discontinued | no data |
Security technologies
Core 2 Duo P8700 and Mobile Sempron SI-40 technologies aimed at improving security, for example, by protecting against hacks.
| TXT | + | no data |
| EDB | + | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by Core 2 Duo P8700 and Mobile Sempron SI-40 are enumerated here.
| VT-x | + | no data |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
3DMark06 CPU
3DMark06 is a discontinued DirectX 9 benchmark suite from Futuremark. Its CPU part contains two scenarios, one dedicated to artificial intelligence pathfinding, another to game physics using PhysX package.
Pros & cons summary
| Recency | 1 January 2009 | 4 July 2008 |
| Physical cores | 2 | 1 |
| Threads | 2 | 1 |
| Chip lithography | 45 nm | 65 nm |
Core 2 Duo P8700 has an age advantage of 5 months, 100% more physical cores and 100% more threads, and a 44.4% more advanced lithography process.
We couldn't decide between Core 2 Duo P8700 and Mobile Sempron SI-40. We've got no test results to judge.
Should you still have questions on choice between Core 2 Duo P8700 and Mobile Sempron SI-40, ask them in Comments section, and we shall answer.
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