Core i3-3210 vs Core 2 Duo E8600
Aggregate performance score
Core i3-3210 outperforms Core 2 Duo E8600 by an impressive 62% based on our aggregate benchmark results.
Primary details
Comparing Core 2 Duo E8600 and Core i3-3210 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 2546 | 2203 |
| Place by popularity | not in top-100 | not in top-100 |
| Cost-effectiveness evaluation | no data | 0.14 |
| Market segment | Desktop processor | Desktop processor |
| Power efficiency | 1.26 | 2.42 |
| Architecture codename | Wolfdale (2008−2010) | Ivy Bridge (2012−2013) |
| Release date | August 2008 (16 years ago) | 1 January 2013 (11 years ago) |
| Launch price (MSRP) | no data | $120 |
Cost-effectiveness evaluation
Performance per price, higher is better.
Detailed specifications
Core 2 Duo E8600 and Core i3-3210 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 2 (Dual-core) | 2 (Dual-core) |
| Threads | 2 | 4 |
| Base clock speed | 3.33 GHz | 3.2 GHz |
| Boost clock speed | 3.33 GHz | 3.2 GHz |
| Bus rate | 1333 MHz | 5 GT/s |
| L1 cache | 64 KB | 64 KB (per core) |
| L2 cache | 6 MB (shared) | 256 KB (per core) |
| L3 cache | 0 KB | 3072 KB (shared) |
| Chip lithography | 45 nm | 22 nm |
| Die size | 107 mm2 | 94 mm2 |
| Maximum case temperature (TCase) | 72 °C | 65 °C |
| Number of transistors | 410 million | no data |
| 64 bit support | + | + |
| Windows 11 compatibility | - | - |
| VID voltage range | 0.85V-1.3625V | no data |
Compatibility
Information on Core 2 Duo E8600 and Core i3-3210 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | 1 |
| Socket | LGA775 | FCLGA1155 |
| Power consumption (TDP) | 65 Watt | 55 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Core 2 Duo E8600 and Core i3-3210. You'll probably need this information if you require some particular technology.
| Instruction set extensions | no data | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX |
| AVX | - | + |
| Enhanced SpeedStep (EIST) | + | + |
| My WiFi | no data | + |
| Turbo Boost Technology | - | - |
| Hyper-Threading Technology | - | + |
| Idle States | + | + |
| Thermal Monitoring | + | + |
| Demand Based Switching | - | no data |
| FDI | no data | + |
| FSB parity | - | no data |
Security technologies
Core 2 Duo E8600 and Core i3-3210 technologies aimed at improving security, for example, by protecting against hacks.
| TXT | + | + |
| EDB | + | + |
| Secure Key | no data | - |
| Identity Protection | - | + |
| Anti-Theft | no data | + |
Virtualization technologies
Virtual machine speed-up technologies supported by Core 2 Duo E8600 and Core i3-3210 are enumerated here.
| VT-d | + | - |
| VT-x | + | + |
| EPT | no data | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Core 2 Duo E8600 and Core i3-3210. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR1, DDR2, DDR3 | DDR3 |
| Maximum memory size | no data | 32 GB |
| Max memory channels | no data | 2 |
| Maximum memory bandwidth | no data | 25.6 GB/s |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | no data | Intel HD Graphics 2500 |
| Quick Sync Video | - | + |
| Clear Video HD | no data | + |
| Graphics max frequency | no data | 1.05 GHz |
| InTru 3D | no data | + |
Graphics interfaces
Available interfaces and connections of Core 2 Duo E8600 and Core i3-3210 integrated GPUs.
| Number of displays supported | no data | 3 |
Peripherals
Specifications and connection of peripherals supported by Core 2 Duo E8600 and Core i3-3210.
| PCIe version | no data | 2.0 |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Combined synthetic benchmark score
This is our combined benchmark performance rating. We are regularly improving our combining algorithms, but if you find some perceived inconsistencies, feel free to speak up in comments section, we usually fix problems quickly.
Passmark
Passmark CPU Mark is a widespread benchmark, consisting of 8 different types of workload, including integer and floating point math, extended instructions, compression, encryption and physics calculation. There is also one separate single-threaded scenario measuring single-core performance.
GeekBench 5 Single-Core
GeekBench 5 Single-Core is a cross-platform application developed in the form of CPU tests that independently recreate certain real-world tasks with which to accurately measure performance. This version uses only a single CPU core.
GeekBench 5 Multi-Core
GeekBench 5 Multi-Core is a cross-platform application developed in the form of CPU tests that independently recreate certain real-world tasks with which to accurately measure performance. This version uses all available CPU cores.
Pros & cons summary
| Performance score | 0.90 | 1.46 |
| Threads | 2 | 4 |
| Chip lithography | 45 nm | 22 nm |
| Power consumption (TDP) | 65 Watt | 55 Watt |
i3-3210 has a 62.2% higher aggregate performance score, 100% more threads, a 104.5% more advanced lithography process, and 18.2% lower power consumption.
The Core i3-3210 is our recommended choice as it beats the Core 2 Duo E8600 in performance tests.
Should you still have questions on choice between Core 2 Duo E8600 and Core i3-3210, ask them in Comments section, and we shall answer.
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