Ryzen 9 3900X vs Core 2 Duo E7500
Aggregate performance score
Ryzen 9 3900X outperforms Core 2 Duo E7500 by a whopping 2753% based on our aggregate benchmark results.
Primary details
Comparing Core 2 Duo E7500 and Ryzen 9 3900X processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 2686 | 269 |
| Place by popularity | not in top-100 | not in top-100 |
| Cost-effectiveness evaluation | no data | 20.87 |
| Market segment | Desktop processor | Desktop processor |
| Series | no data | AMD Ryzen 9 |
| Power efficiency | 1.05 | 15.55 |
| Architecture codename | Wolfdale (2008−2010) | Matisse (Zen 2) (2019−2020) |
| Release date | 10 January 2009 (15 years ago) | 7 July 2019 (5 years ago) |
| Launch price (MSRP) | no data | $499 |
Cost-effectiveness evaluation
Performance per price, higher is better.
Detailed specifications
Core 2 Duo E7500 and Ryzen 9 3900X basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 2 (Dual-core) | 12 (Dodeca-Core) |
| Threads | 2 | 24 |
| Base clock speed | 2.93 GHz | 3.8 GHz |
| Boost clock speed | 0.93 GHz | 4.6 GHz |
| Bus rate | 1066 MHz | no data |
| L1 cache | 64 KB (per core) | 96K (per core) |
| L2 cache | 3 MB (shared) | 512K (per core) |
| L3 cache | 0 KB | 64 MB |
| Chip lithography | 45 nm | 7 nm, 12 nm |
| Die size | 82 mm2 | no data |
| Maximum core temperature | no data | 95 °C |
| Maximum case temperature (TCase) | 74 °C | no data |
| Number of transistors | 228 million | 19,200 million |
| 64 bit support | + | + |
| Windows 11 compatibility | - | + |
| Unlocked multiplier | - | + |
| VID voltage range | 0.85V-1.3625V | no data |
Compatibility
Information on Core 2 Duo E7500 and Ryzen 9 3900X compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | 1 (Uniprocessor) |
| Socket | LGA775 | AM4 |
| Power consumption (TDP) | 65 Watt | 125 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Core 2 Duo E7500 and Ryzen 9 3900X. You'll probably need this information if you require some particular technology.
| AES-NI | - | + |
| AVX | - | + |
| Enhanced SpeedStep (EIST) | + | no data |
| Turbo Boost Technology | - | no data |
| Hyper-Threading Technology | - | no data |
| Idle States | + | no data |
| Thermal Monitoring | + | - |
| Demand Based Switching | - | no data |
| FSB parity | - | no data |
| Precision Boost 2 | no data | + |
Security technologies
Core 2 Duo E7500 and Ryzen 9 3900X technologies aimed at improving security, for example, by protecting against hacks.
| TXT | - | no data |
| EDB | + | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by Core 2 Duo E7500 and Ryzen 9 3900X are enumerated here.
| AMD-V | - | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Core 2 Duo E7500 and Ryzen 9 3900X. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR1, DDR2, DDR3 | DDR4 Dual-channel |
| Maximum memory size | no data | 128 GB |
| Max memory channels | no data | 2 |
| Maximum memory bandwidth | no data | 51.196 GB/s |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | On certain motherboards (Chipset feature) | - |
Peripherals
Specifications and connection of peripherals supported by Core 2 Duo E7500 and Ryzen 9 3900X.
| PCIe version | 2.0 | no data |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Combined synthetic benchmark score
This is our combined benchmark performance rating. We are regularly improving our combining algorithms, but if you find some perceived inconsistencies, feel free to speak up in comments section, we usually fix problems quickly.
Passmark
Passmark CPU Mark is a widespread benchmark, consisting of 8 different types of workload, including integer and floating point math, extended instructions, compression, encryption and physics calculation. There is also one separate single-threaded scenario measuring single-core performance.
GeekBench 5 Single-Core
GeekBench 5 Single-Core is a cross-platform application developed in the form of CPU tests that independently recreate certain real-world tasks with which to accurately measure performance. This version uses only a single CPU core.
GeekBench 5 Multi-Core
GeekBench 5 Multi-Core is a cross-platform application developed in the form of CPU tests that independently recreate certain real-world tasks with which to accurately measure performance. This version uses all available CPU cores.
Pros & cons summary
| Performance score | 0.72 | 20.54 |
| Recency | 10 January 2009 | 7 July 2019 |
| Physical cores | 2 | 12 |
| Threads | 2 | 24 |
| Chip lithography | 45 nm | 7 nm |
| Power consumption (TDP) | 65 Watt | 125 Watt |
Core 2 Duo E7500 has 92.3% lower power consumption.
Ryzen 9 3900X, on the other hand, has a 2752.8% higher aggregate performance score, an age advantage of 10 years, 500% more physical cores and 1100% more threads, and a 542.9% more advanced lithography process.
The Ryzen 9 3900X is our recommended choice as it beats the Core 2 Duo E7500 in performance tests.
Should you still have questions on choice between Core 2 Duo E7500 and Ryzen 9 3900X, ask them in Comments section, and we shall answer.
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